Ceramic Wafer Support RF Link Layout to Prevent Plate Hot Spots
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Solution Overview
Problem
In semiconductor manufacturing apparatuses, the temperature in the hollow interior of a ceramic shaft can increase due to heat generated by an RF connector, leading to a potential hot spot in the ceramic plate, even with reduced heat generation per RF rod.
Innovation Solution
A member for semiconductor manufacturing apparatus with an RF electrode embedded in a ceramic plate, an RF connector disposed outside the ceramic shaft, and an RF link member with a branching portion of RF rods extending outside, reducing heat generation and resistance, and allowing for reduced connection points and increased surface area, thereby preventing hot spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an RF connector is disposed in the hollow interior of the ceramic shaft, then the structure is compact and easy to connect, but the temperature in the hollow interior increases due to heat generated by the RF connector, leading to potential hot spots in the ceramic plate
Solution Approach 1:
The RF connector is extracted from the hollow interior of the ceramic shaft and disposed outside. This separation removes the heat source (RF connector) from the confined space, preventing heat accumulation in the hollow interior that would otherwise lead to hot spots in the ceramic plate, while the RF link member provides the necessary electrical connection.
2Device complexity
If a single RF rod is used, then the structure is simple, but the current flowing per RF rod is high, generating excessive heat and causing hot spots
Solution Approach 1:
The single RF rod is segmented into multiple RF rods (first RF rod and second RF rod) that branch off from the RF link member. This segmentation divides the total current into multiple parallel paths, reducing the current density and heat generation in each individual RF rod, thereby preventing hot spots while maintaining structural integrity.
3Loss of energy
If multiple RF rods are used to reduce current per rod, then heat generation per RF rod is reduced, but the surface area of the current flow path is small, causing increased resistance due to the skin effect
Solution Approach 1:
The RF link member extends in the axial direction (another dimension) with multiple RF rods branching off at different positions. This three-dimensional arrangement increases the effective surface area of the current flow path compared to a planar configuration, reducing the skin effect and associated resistance while maintaining reduced current per rod.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents hot spots in the ceramic plate by reducing heat generation and resistance through the RF link member's design, ensuring reliable operation and minimizing the risk of ceramic plate breakage.
Implementation Method 1
This increases the surface area of the current flow path of the RF link member, thus decreasing the increase in resistance due to the skin effect
Implementation Method 2
the temperature in the hollow interior of the ceramic shaft may increase due to the heat generated by the RF connector
Data Source
AI summary
A member for semiconductor manufacturing apparatus has a structure in which a hollow ceramic shaft is provided on a back surface of a ceramic plate having a front surface serving as a wafer placement surface. The member for semiconductor manufacturing apparatus includes an RF electrode embedded in the ceramic plate, an RF connector disposed outside of the hollow interior of the ceramic shaft, and an RF link member provided between the RF connector and the RF electrode. The RF link member has a branching portion consisting of a plurality of RF rods, and the branching portion extends to the outside of the ceramic shaft.