Ceramic Sample Holder Structure for Thermal Uniformity and Insulation
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Solution Overview
Problem
Existing sample holders for semiconductor manufacturing lack effective thermal uniformity and insulation, leading to inefficient heat management and potential thermal influences on the sample holding face.
Innovation Solution
A sample holder design featuring a ceramic substrate with a heat-generating resistor, a metallic member with a through hole, a bonding layer, a conduction section, a joining member, and a low-thermal-conductivity member, which collectively enhance thermal uniformity and insulation by managing heat distribution and reducing thermal conductivity in critical areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional sample holder structure is used, then the structure is simple, but thermal uniformity on the sample holding face is poor and heat loss is high
Solution Approach 1:
The sample holder is divided into functionally distinct segments: a ceramic substrate for sample holding, a metallic support for structural integrity, a heat-generating resistor for heating, a bonding layer for joining, and a low-thermal-conductivity member for insulation. Each segment performs a specific thermal function, collectively achieving uniform temperature distribution while managing heat loss.
Solution Approach 2:
The sample holder employs composite material construction by combining ceramic substrate (high thermal stability), metallic support (mechanical strength), bonding layer (thermal interface), and low-thermal-conductivity member (insulation). This multi-material approach optimizes both thermal uniformity and heat management across different functional zones.
2Temperature
If heat-generating resistor is disposed on ceramic base, then heating function is provided, but thermal uniformity and insulation are insufficient
Solution Approach 1:
The bonding layer acts as an intermediary between the heat-generating resistor and the ceramic substrate, mediating heat transfer to achieve uniform distribution. The low-thermal-conductivity member serves as an intermediary insulation barrier, preventing unwanted heat loss while maintaining thermal uniformity on the sample holding face.
Solution Approach 2:
Different regions of the sample holder have differentiated thermal properties: the bonding layer region provides thermal conduction for uniform heat distribution, while the low-thermal-conductivity member region provides thermal insulation to reduce heat loss. This local differentiation of thermal quality achieves both heating efficiency and thermal management.
3Strength
If metallic support is joined to ceramic base, then structural support is provided, but thermal conductivity is too high causing heat loss
Solution Approach 1:
The metallic support provides structural strength where mechanical load is required, while the low-thermal-conductivity member is positioned in regions where thermal insulation is critical. This spatial differentiation allows the metallic support to fulfill its structural function without causing excessive heat loss in thermal-sensitive areas.
Solution Approach 2:
The bonding layer serves as a thermal intermediary between the metallic support and ceramic substrate, controlling heat transfer from the high-conductivity metal to the ceramic. This intermediary layer prevents direct thermal coupling that would cause heat loss, while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sample holder achieves improved thermal uniformity on the sample holding face, reduces heat loss, and increases insulation capacity, thereby enhancing the reliability and precision of semiconductor manufacturing processes.
Implementation Method 1
a heat-generating resistor disposed in an interior of the ceramic substrate or on the other principal surface of the ceramic substrate
Implementation Method 2
a bonding layer configured to bond the other principal surface of the ceramic substrate to the one principal surface of the metallic member
Implementation Method 3
a low-thermal-conductivity member configured to cover the joining member, the low-thermal-conductivity member being lower in thermal conductivity than the bonding layer
Data Source
AI summary
A sample holder according to the disclosure includes: for example, a plate-like ceramic substrate; a heat-generating resistor; a metallic member configured to cover another principal surface of the ceramic substrate; a bonding layer configured to bond the ceramic substrate and the metallic member; a lead terminal; a conduction section which is disposed inside the bonding layer and is configured to electrically connect the heat-generating resistor and the lead terminal; and a joining member configured to join the conduction section and the lead terminal. The joining member is covered with a low-thermal-conductivity member which is lower in thermal conductivity than the bonding layer.