Composite Ceramic Sandwich Plate for Flatness and Thickness Uniformity
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Solution Overview
Problem
Traditional multi-layer composite ceramic plates used in semiconductor manufacturing, such as electrostatic chucks and ceramic heating plates, face challenges in achieving uniform thickness and surface flatness, which are critical for precise semiconductor processing, with existing manufacturing methods either compromising on stability or being difficult to execute.
Innovation Solution
A manufacturing method involving a graphite hot-pressing mold to form a multi-layer composite ceramic plate with a basic sandwich structure, where pre-sintered ceramic members and metal electrode layers are integrated through hot-pressing sintering, ensuring uniformity and flatness, and allowing for the formation of either a basic sandwich structure or a five-layer composite plate with enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sintering layer by layer method is used, then processing quality of each layer is guaranteed, but the ceramic plate has poor stability and reliability
Solution Approach 1:
The manufacturing process is segmented into two distinct stages: pre-sintering individual layers separately to ensure precise processing quality, followed by a final consolidation sintering step that bonds all layers into a unified, reliable structure. This segmentation allows each layer to be optimized independently while achieving overall structural integrity.
Solution Approach 2:
The pre-sintering step is performed as a preliminary action before final consolidation. Each ceramic layer is pre-sintered individually to establish precise dimensions and properties, then metal electrode layers are applied, and finally all components are consolidated through one-stage sintering to achieve reliable bonding.
2Reliability
If sintering as a whole method is used, then layers are bonded firmly and reliably, but the process is too difficult to meet high requirements for flatness
Solution Approach 1:
The sintering process is segmented into pre-sintering individual layers with controlled flatness, then final consolidation sintering to bond layers reliably. This segmentation allows flatness to be controlled during pre-sintering while achieving reliable bonding in the final step.
Solution Approach 2:
Flatness control is performed as a preliminary action during the pre-sintering stage of each layer before assembly. This preliminary flatness preparation enables the final consolidation sintering to focus on reliable bonding without compromising flatness requirements.
3Device complexity
If traditional multi-layer composite ceramic plate structure is used, then basic sandwich structure is formed, but uniformity in thickness and surface flatness cannot be achieved
Solution Approach 1:
Each ceramic layer undergoes pre-sintering with controlled thickness and flatness as a preliminary action before assembly. Metal electrode layers are applied in advance on pre-sintered ceramic layers. The final consolidation sintering then bonds these pre-prepared layers, ensuring uniform thickness and surface flatness while maintaining the sandwich structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in ceramic plates with improved flatness and uniform thickness, offering high precision, simplicity, and high yield, suitable for industrial production and reliable performance in semiconductor processing.
Implementation Method 1
carrying out hot-pressing sintering in the axial direction of the pre-sintered ceramic member at the sintering temperature to form an integral part
Data Source
AI summary
Disclosed are a multi-layer composite ceramic plate and a manufacturing method thereof. The composite ceramic plate includes at least one basic sandwich structure. The manufacturing method includes: preparing a sheet-like green body with ceramic powders; pre-sintering the green body at a pre-sintering temperature lower than the sintering temperature to obtain a pre-sintered ceramic member with certain strength; forming a metal electrode layer on an upper surface of the pre-sintered ceramic member; placing the pre-sintered ceramic member in a mold, with the upper surface coated with the metal electrode layer facing upwards; providing a ceramic precursor layer on the upper surface of the pre-sintered ceramic member; carrying out hot-pressing sintering in the axial direction of the pre-sintered ceramic member at the sintering temperature to form an integral structure, wherein by the hot-pressing sintering, a second ceramic layer is formed by the pre-sintered ceramic member, a first ceramic layer is formed by the ceramic precursor layer, and the metal electrode layer is located between the first ceramic layer and the second ceramic layer to from a basic sandwich structure together with the first ceramic layer and the second ceramic layer.