Ceramic Panel Scribe Line Wells for Breakage-Resistant Singulation
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Solution Overview
Problem
Substrate scribing during singulation can lead to premature breakage or damage due to long or deep scribe lines, while short or shallow scribe lines result in difficult singulation, device failures, and potential burrs or cracks, with deep scribe lines also partially healing.
Innovation Solution
The formation of scribe line wells on ceramic panels, where scribe lines are created along these wells, reducing the depth of scribe lines through the ceramic material and maintaining or increasing their depth beneath the panel surface, thereby reducing the risk of healing and facilitating clean singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If long or deep scribe lines are used, then singulation can be achieved, but premature breakage and damage occur during substrate handling
Solution Approach 1:
The scribe line structure is segmented into multiple components: a first scribe line portion extending from the first surface to a first depth, and a second scribe line portion extending from the second surface to a second depth. These portions are offset laterally relative to each other, creating a stepped configuration that prevents continuous deep penetration through the substrate thickness, thereby reducing breakage risk while maintaining singulation capability
Solution Approach 2:
The invention transitions from a traditional single-dimensional deep scribe approach to a multi-dimensional stepped configuration. By offsetting the first and second scribe line portions laterally and creating different depths from opposite surfaces, the solution adds spatial complexity that prevents premature breakage while achieving effective singulation
2Reliability
If short or shallow scribe lines are used, then premature breakage is reduced, but substrates become hard to singulate
Solution Approach 1:
The scribe line is divided into segmented portions with different characteristics: shallow portions from each surface that do not meet in the middle, creating discrete fracture zones that guide clean separation without requiring excessive depth that would cause breakage
Solution Approach 2:
Different regions of the scribe line structure have different properties: the first scribe line portion has a specific depth and lateral position, while the second scribe line portion has different depth and lateral position. This local variation in scribe line characteristics optimizes both handling reliability and singulation quality in different zones
3Manufacturing precision
If deep scribe lines are used, then singulation can be achieved, but the scribe lines partially heal themselves
Solution Approach 1:
Instead of creating a single deep scribe line that penetrates the entire substrate thickness, the invention uses partial action by creating two shallower scribe line portions from opposite surfaces that offset laterally. This partial penetration approach from each surface prevents the healing effect that occurs with deep continuous scribe lines while maintaining effective singulation capability
Data Source
AI summary
An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.