Multilayer Ceramic Sensor Chip With Damping Layer for Bonding Stability
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Solution Overview
Problem
The existing process of manufacturing ceramic chips for temperature measurement in high power modules is complex, expensive, and prone to mechanical damage due to geometry variations and high forces during bonding, leading to high reject rates and non-uniform components.
Innovation Solution
A sensor device with a multilayer ceramic chip structure, where unprinted and printed ceramic layers are stacked with electrically conductive materials like palladium, platinum, copper, or gold, and a damping layer is applied to absorb mechanical forces, ensuring consistent geometry and precise resistance adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ceramic chips are cut out of a sintered and polished substrate to control resistance by geometry, then resistance can be controlled, but the process becomes complex, expensive, and prone to mechanical damage with high reject rates
Solution Approach 1:
The patent transitions from controlling resistance through geometric dimensions (length, width, thickness) to controlling resistance through the cross-sectional area of conductive paths within the ceramic substrate. This dimensional shift allows precise resistance control without requiring complex geometric cutting and finishing operations, thereby simplifying the manufacturing process while maintaining precision.
Solution Approach 2:
The patent extracts the resistance control function from the geometric shape of the ceramic chip and relocates it to the internal conductive path configuration. By separating the resistance determination from the external geometry, the manufacturing process is simplified as chips no longer require precise cutting and polishing to achieve target resistance values.
2Strength
If high forces are applied during bonding to meet bonding technology requirements, then bonding strength is achieved, but mechanical damage such as chipping and complete breakage occurs
Solution Approach 1:
The patent applies a damping layer to the ceramic chip before the bonding process. This damping layer serves as a protective cushion that absorbs and distributes the high forces applied during bonding, preventing direct transmission of these forces to the fragile ceramic chip structure. This prior cushioning enables achievement of required bonding strength while maintaining chip integrity and preventing mechanical damage.
3Strength
If ceramic chip thickness is increased or more robust ceramic material is used to reduce mechanical damage, then mechanical strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent introduces a damping layer as an intermediary element between the ceramic chip and the bonding interface. This damping layer provides the necessary mechanical strength and damage protection without requiring changes to the ceramic chip itself (such as increasing thickness or using more robust materials). The intermediary layer absorbs mechanical stresses, allowing the use of standard ceramic materials and thicknesses while still achieving high bonding strength and preventing damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a robust, cost-effective sensor device with minimized mechanical damage and improved accuracy, allowing for precise resistance control and uniform geometry, reducing reject rates and enhancing the stability of the sensor chip during bonding.
Implementation Method 1
at least one damping layer (14) is applied directly to at least a partial area of an outer surface (16a) of the sensor chip (16)
Implementation Method 2
The electrically conductive material on the printed ceramic layers acts as inner electrodes of the sensor chip
Implementation Method 3
The ceramic layers preferably have a material with NTC (Negative Temperature Coefficient) characteristics
Data Source
AI summary
In an embodiment a sensor device includes a sensor chip having a plurality of printed ceramic layers and unprinted ceramic layers, at least one termination layer configured to make electrical contact with an electrically conductive material, wherein the termination layer is formed at least on a top side and/or on a bottom side of the sensor chip, wherein the printed ceramic layers are at least partially printed with an electrically conductive material, and wherein an electrical resistance of the sensor chip is determined by an overlap area of the electrically conductive material or by a distance of the electrically conductive material from the termination layer and at least one damping layer directly located at at least a partial area of an outer surface of the sensor chip, wherein the damping layer includes a material which has a greater elasticity than a material of the termination layer.