Ceramic Sensor Chip Layout for Surface Sensitivity at 200°C

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Solution Overview

Problem

Existing sensor designs face challenges in achieving optimal temperature surface sensitivity, high operating temperatures up to 200°C, and cost-effective mass production while meeting high voltage withstand and humidity resistance requirements due to material limitations and packaging constraints.

Innovation Solution

A sensor arrangement utilizing a ceramic-based substrate with NTC or PTC sensor chips, U-shaped contact elements, and a thermoset epoxy insulating body, which ensures electrical insulation, humidity resistance, and thermal conductivity, allowing for high surface sensitivity, compact size, and robust operation up to 200°C.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If intensive packaging is used to meet voltage withstand and humidity resistance requirements, then reliability is improved, but temperature surface sensitivity deteriorates

Engineering Contradiction:

Improvevoltage withstand and humidity resistanceVSAvoidtemperature surface sensitivity

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent transitions from vertical stacking to horizontal arrangement of sensor chips on the substrate surface. This dimensional change allows the sensor chips to be positioned flat against the substrate, maximizing thermal contact area and surface sensitivity while the substrate's thickness and material properties maintain voltage withstand and humidity resistance capabilities.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it provides mechanical support, ensures electrical insulation, achieves voltage withstand, provides humidity resistance, and facilitates thermal conduction to the sensor chips. This multi-functionality eliminates the need for separate packaging components, maintaining reliability without compromising temperature measurement sensitivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If material selection is limited to meet cost and mass production requirements, then ease of manufacture is improved, but operating temperature capability deteriorates

Engineering Contradiction:

Improvecost and mass production suitabilityVSAvoidoperating temperature up to 200°C

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs a composite structure combining the substrate material with specialized sensor chip materials and bonding agents. The substrate provides mechanical and environmental stability, while the sensor chips and bonding materials are selected for high-temperature capability. This composite approach enables operation at 200°C using materials and processes suitable for cost-effective mass production.

Inventive Principle:

Principle #40Composite materials

3Measurement precision

If sensor chips are arranged vertically to improve surface sensitivity, then measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvesurface sensitivityVSAvoidposition constraints and packaging complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

Instead of stacking sensor chips vertically to achieve surface sensitivity, the patent inverts the approach by placing sensor chips horizontally flat against the substrate surface. This inversion simplifies the mechanical arrangement and packaging while maintaining large thermal contact area, thereby achieving surface sensitivity without increased device complexity.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a fast-response, cost-effective sensor arrangement with high voltage withstand and humidity resistance, suitable for mass production, offering excellent surface sensitivity and accurate temperature measurement at elevated temperatures.

Implementation Method 1

The substrate may be a high performing ceramic substrate which is excellent in electrical insulation and humidity resistance and has a high thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The sensor chip may be a NTC sensor chip. Alternatively, the sensor chip may be a PTC (Positive Temperature Coefficient) sensor chip

Methodology Applied

Scientific EffectNegative temperature coefficient effect: Thermistor

Data Source

PatentUS12560489B2Sensor arrangement and method for producing a sensor arrangement

Publication Date: 2026.02.24 TDK ELECTRONICS AG

AI summary

In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.