Ceramic Sensor Module Diaphragm Interference Reduction
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Solution Overview
Problem
Strain gauge pressure sensors face challenges in assembly efficiency and production costs due to the complex process of attaching electronic components to flexible circuit boards, which interferes with the diaphragm and affects measurement accuracy.
Innovation Solution
A physical quantity measuring device with a sensor module housed in a ceramic module body, featuring a diaphragm, a cylindrical portion, and an electronic component placed on the cylindrical portion radially outward from the diaphragm, allowing for easy assembly and connection via an elastic conductive member without hindering diaphragm displacement, and optionally including a temperature measuring element on the cylindrical portion for improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is attached to the flexible circuit board, then the electronic component can be electrically connected to the pressure-sensitive element, but the assembly process becomes complicated and production efficiency decreases
Solution Approach 1:
The device is divided into separate functional modules: the pressure-sensitive element with diaphragm, the electronic component mounted on the rigid substrate, and the flexible circuit board as a separate connector. This segmentation allows each component to be optimized independently and assembled through simple stacking, eliminating complex attachment processes while maintaining reliable electrical connections through the flexible circuit board's contact pads.
Solution Approach 2:
The flexible circuit board is inserted into a groove on the rigid substrate, creating a nested structure where the flexible board fits within the rigid substrate's recess. This nesting arrangement secures the flexible circuit board in place while allowing for easy assembly and disassembly, improving production efficiency without compromising connection reliability.
2Ease of manufacture
If the electronic component is mounted on the pressure-sensitive element surface, then the assembly is simplified, but the electronic component interferes with the diaphragm displacement and reduces measurement accuracy
Solution Approach 1:
The electronic component is relocated from the diaphragm surface to the rigid substrate, which is positioned in a different spatial dimension (below the diaphragm plane). This dimensional relocation eliminates interference with diaphragm displacement while maintaining electrical connectivity through the flexible circuit board that bridges the two components.
Solution Approach 2:
The electronic component is extracted from the diaphragm surface and placed on the rigid substrate. This separation removes the interfering element from the measurement zone while preserving its functional role through the flexible circuit board connection, thereby maintaining measurement precision.
3Reliability
If the flexible circuit board is used to connect the electronic component, then electrical connection is achieved, but the attachment process becomes complicated and production costs increase
Solution Approach 1:
The flexible circuit board is pre-formed with contact pads and routing patterns before assembly. The rigid substrate is pre-equipped with grooves and mounting features. This preliminary preparation allows for rapid, tool-free assembly through simple insertion and stacking operations, reducing attachment process complexity while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and efficient assembly of the sensor module with improved measurement accuracy by avoiding mechanical interference between the electronic component and diaphragm, reducing production costs, and maintaining measurement precision even with a temperature measuring element.
Implementation Method 1
an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and the sensor module
Implementation Method 2
a detector provided on a flat surface of the diaphragm opposite to a surface of the diaphragm that is to be in contact with the fluid to be measured, the detector detecting a displacement of the diaphragm
Data Source
Figure 1
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Figure 3
AI summary
A sensor module (2) comprising: a ceramic module body (20) comprising: a diaphragm (21) displaceable b a pressure of a fluid to be measured introduced into the sensor module; and a cylindrical portion (22) integral with a periphery of the diaphragm (21); detector (23) provided on a flat surface (21A) of the diaphragm (21) opposite to a surface of the diaphragm (21) that is to be in contact with the fluid to be measured, the detector (23) detecting a displacement of the diaphragm (21); a pad (24) provided on a flat surface (22B) of the cylindrical portion (22) radially outwardly adjacent to the flat surface (21A of the diaphragm (21); and an electronic component (25) provided on the flat surface (22B) of the cylindrical portion (22) and electrically connected to the detector (23) and the pad (24), wherein the electronic component (25) is provided opposite to the pad (24) with respect to the flat surface (21A) of the diaphragm (21), and at least one positioning outer groove (20A) is provided on an outer periphery of the cylindrical portion (22) in parallel with an axial direction of the cylindrical portion (22).