Ceramic Sensor Electrode Coating for High-Temperature Stability

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Solution Overview

Problem

Existing sensor elements, particularly temperature sensors, face challenges in achieving long-term stability in aggressive media and high operating temperatures while maintaining cost-effectiveness, with existing methods like metallization pastes requiring high thermal loads and complex processing.

Innovation Solution

A sensor element with a ceramic base body featuring a nickel-containing electrode layer, sputtered directly onto the ceramic, which includes a 7% vanadium portion for improved mechanical and electrical connection, and a cover layer for corrosion protection, allowing for flexible material choices and reduced thermal stress during manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If metallization paste is applied using screen-printing followed by firing, then the electrode can be applied to the ceramic, but high thermal loads and complex processing are required

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidthermal load
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent replaces the traditional screen-printing and firing process with a sputtering process, substituting a thermal/mechanical manufacturing approach with a physical vapor deposition method. This eliminates the need for high-temperature baking (700°C–900°C) and complex paste application, directly resolving the contradiction between ease of manufacture and thermal load requirements.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental processing parameters from high-temperature thermal processing to low-temperature physical deposition. The sputtering process operates at significantly lower temperatures compared to traditional firing, thereby reducing thermal loads while simplifying the manufacturing process through a single-step deposition method.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If thick-film electrodes made of silver or gold pastes are used, then the electrode can be applied to the ceramic, but high-temperature baking is required

Engineering Contradiction:
Improveelectrode application processVSAvoidbaking temperature
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent replaces the thermal baking process required for thick-film paste electrodes with a sputtering-based physical vapor deposition process. This substitution eliminates the need for high-temperature baking entirely, as the metallic layers are deposited directly onto the ceramic substrate at low temperatures, thereby simplifying manufacturing while reducing thermal requirements.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If a nickel-containing layer is sputtered directly onto the ceramic, then mechanical and electrical connection is improved, but additional sputtering process is needed

Engineering Contradiction:
Improvemechanical and electrical connectionVSAvoidmanufacturing process steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the functions of adhesion promotion, electrical conduction, and mechanical bonding into a single nickel-containing layer deposited by sputtering. This multi-functional layer eliminates the need for separate adhesion promoters and simplifies the overall electrode structure, thereby improving reliability while actually reducing process complexity compared to multi-layer paste systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a composite electrode structure where a nickel-containing layer (with 7 wt% vanadium) is combined with a silver or gold cover layer. This composite material approach provides both excellent adhesion to the ceramic substrate and superior electrical conductivity, achieving enhanced mechanical and electrical connection through material composition rather than process complexity.

Inventive Principle:
Principle #40Composite materials

4Productivity

If vanadium is added to the nickel layer at 7 wt%, then sputtering process performance is improved, but material composition complexity increases

Engineering Contradiction:
Improvesputtering process efficiencyVSAvoidmaterial composition
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent optimizes the material composition parameter by incorporating exactly 7 wt% vanadium in the nickel layer, a specific concentration that enhances sputtering process performance. This precise parameter control improves productivity by ensuring optimal deposition rates and film quality, while the fixed composition actually simplifies material handling compared to variable-composition systems.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced temperature resistance, long-term stability, and cost-effective production by eliminating the need for high-temperature baking and paste application, while enabling reliable contact with various materials and improved mechanical resilience.

Implementation Method 1

The nickel-containing layer is sputtered. The nickel-containing layer is applied directly to the ceramic of the base body and is thus in direct contact with the ceramic.

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentEP4089382B1Sensor element and sensor arrangement
Publication Date: 2024.08.28 TDK ELECTRONICS AG
  • EP4089382B1 patent drawingFigure 1~2
  • EP4089382B1 patent drawingFigure 3A~3B
  • EP4089382B1 patent drawingFigure 4A~4B

AI summary

A sensor element comprising a ceramic base body (2) and at least one electrode (4, 8) arranged on the base body (2) is specified, wherein the electrode (4, 8) has at least one layer (5) containing nickel and vanadium.