Ceramic Thin Film Sensor One-Time Pyrolysis for Faster Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for preparing polymer-derived ceramic (PDC) thin film sensors are inefficient due to the need for multiple pyrolysis steps, which increases processing time and complexity, limiting their application range and efficiency.
Innovation Solution
A one-time pyrolysis process is used to simultaneously pyrolyze a protective layer, solder, and sensitive layer, simplifying the process and eliminating the need for multiple pyrolysis steps, thereby enhancing efficiency and expanding the application range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple pyrolysis steps are performed for different layers, then each layer can be properly processed, but the preparation time increases significantly and process complexity increases
Solution Approach 1:
The patent combines multiple separate pyrolysis steps into a single unified pyrolysis process. The sensitive layer, protective layer, and solder are all processed simultaneously in one pyrolysis step, eliminating the need for sequential processing. This merging of operations reduces preparation time by more than 10 hours while maintaining proper processing of each layer through optimized pyrolysis parameters (temperature range, heating rate, atmosphere control).
Solution Approach 2:
The patent develops a universal pyrolysis process that can handle multiple different materials (sensitive layer precursor, protective layer precursor, solder) with different requirements in a single operation. The process is designed to accommodate the diverse pyrolysis needs of various layers simultaneously, making the process applicable to different sensor types (temperature sensors, heat flow sensors) without requiring separate specialized processing steps for each layer type.
2Reliability
If multiple pyrolysis steps are performed for different layers, then each layer can be properly processed, but the process complexity increases
Solution Approach 1:
The patent merges multiple independent pyrolysis processes into a single integrated process. Instead of performing separate pyrolysis operations for the sensitive layer, protective layer, and solder at different times with different parameters, all layers are processed together in one continuous pyrolysis step. This consolidation simplifies the process flow, reduces the number of process parameters to control, and eliminates the complexity of coordinating multiple sequential operations while ensuring each layer receives appropriate processing conditions.
3Reliability
If conventional pyrolysis methods are used, then the process is well-established, but the preparation efficiency is low
Solution Approach 1:
The patent optimizes pyrolysis parameters to achieve both process stability and high efficiency. By carefully selecting and controlling parameters such as pyrolysis temperature (800-1100°C), heating rate (3-10°C/min), holding time (1-3 hours), and atmosphere composition, the process achieves rapid simultaneous pyrolysis of all layers. These parameter optimizations enable the single-step process to maintain the reliability and material quality of conventional methods while increasing preparation efficiency by reducing total processing time by more than 10 hours.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the preparation time of PDC thin film sensors by more than 10 hours, simplifies the process, and allows for a wider application range without the need for specific sensitive layer compositions.
Implementation Method 1
heating and curing the sensitive layer precursor liquid to obtain a sensitive layer precursor layer
Implementation Method 2
heating and curing the protective layer precursor liquid to obtain a protective layer precursor layer
Implementation Method 3
heating and curing the solder to thereby obtain a device
Implementation Method 4
heating the device obtained in the step 3 to a temperature of 800-1100° C. at a heating rate of 3-10° C./min, and keeping the temperature for 1-3 hours to thereby obtain the polymer-derived high-temperature ceramic thin film sensor
Data Source
AI summary
A preparation method of a polymer-derived high-temperature ceramic thin film sensor is provided. Specifically, a sensitive layer precursor layer is prepared by spraying a sensitive layer precursor liquid on an alumina substrate, and the sensitive layer precursor liquid is obtained by mixing precursor liquid with conductive powder. A protective layer precursor liquid is prepared by spraying protective layer precursor liquid on the sensitive layer precursor layer, and the protective layer precursor liquid is obtained by mixing TiB2 nano-powder, insulating powder and the precursor liquid. The protective layer precursor layer, a solder and the sensitive layer precursor layer are simultaneously pyrolyzed by a one-time pyrolysis process, and thus a protective layer, the solder joints and the sensitive layer are obtained simultaneously. Thus, there is no need to pyrolyze the sensitive layer first, saving the time for pyrolyzing the sensitive layer.