Ceramic Sensor Device High-Temperature Connection via Screen Printing Paste
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Solution Overview
Problem
Existing sensor devices for temperature measurement face challenges in achieving a simple and stable structure, particularly at high temperatures, due to the limitations of solder connections which are not suitable for stable connections beyond a certain temperature range.
Innovation Solution
A sensor device featuring a ceramic carrier substrate with conductor tracks and ceramic NTC elements connected via baked-in screen printing paste, allowing for a solder-free, high-temperature-resistant connection, and enabling the detection of temperatures up to 1000°C using multiple NTC elements connected in series or parallel configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder connections are used to connect sensor elements to conductor tracks, then electrical connection is achieved, but the connection becomes unstable at high temperatures above the solder's melting point
Solution Approach 1:
The patent changes the material parameter of the connection medium from solder (with low melting point) to screen printing paste (with high temperature resistance). The screen printing paste maintains its mechanical and electrical properties at temperatures up to 1000°C, resolving the contradiction between connection stability and maximum operating temperature.
Solution Approach 2:
The patent replaces the mechanical soldering process with a screen printing and firing process. Instead of using solder that melts and solidifies to create connections, the patent uses screen printing paste that is fired into the ceramic substrate, creating a mechanically stable and electrically conductive connection that withstands high temperatures.
2Temperature
If ceramic components and screen printing paste are used for high-temperature measurement, then temperature resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. The screen printing paste is applied to create both the conductor tracks on the ceramic substrate and the electrical contacts on the NTC element in one printing operation. The subsequent firing process simultaneously sinteres the paste into the ceramic and creates the electrical connection, simplifying manufacturing despite the high temperature requirements.
Solution Approach 2:
The screen printing paste serves multiple functions: it creates the conductor tracks, provides electrical contact to the NTC element, and acts as a high-temperature resistant bonding agent. This multi-functionality reduces the number of separate components and manufacturing steps needed, offsetting the complexity introduced by high-temperature processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor device provides a stable and efficient temperature measurement capability across a wide range, including high temperatures, by utilizing ceramic components and screen printing paste connections, which maintain mechanical and electrical stability, and allow for precise resistance adjustment and accurate temperature field detection.
Implementation Method 1
The ceramic component preferably includes a temperature-dependent resistor, by means of which a detected physical variable can be converted into an electrical signal. The NTC element preferably is present as an unhoused ceramic chip. The NTC ceramic preferably has a high sensitivity with regard to a temperature measurement.
Implementation Method 2
The at least one NTC element is firmly mechanically connected to the conductor tracks of the ceramic carrier substrate of the sensor device by means of a baked-in screen printing paste. In a firing step, the NTC element is baked with the screen printing paste of the conductor tracks, or with a screen printing paste that has been specially applied to the already baked conductor tracks, so that a high-temperature-resistant, electrically conductive and mechanically stable connection between the conductor tracks 2a, 2b of the carrier substrate 1 and the NTC element 3 takes place.
Data Source
AI summary
A sensor device is provided, comprising a ceramic support substrate (1), wherein at least two conduction paths (2a, 2b) are disposed on the support substrate (1). The sensor device comprises at least one ceramic component in the form of a chip that is connected to the conduction paths (2a, 2b) in an electrically conducting manner. The at least one ceramic component is mechanically connected to the conduction paths (2a, 2b) by way of a burnt-in screen printing paste.