Ceramic Shower Plate Layout for Process Gas Thermal Uniformity
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Solution Overview
Problem
Existing shower plates used in semiconductor manufacturing experience issues with thermal uniformity of process gases due to heat conduction from intermediate channels to the exterior, leading to localized temperature drops and potential solidification of the gas, which can cause substrate failures.
Innovation Solution
Incorporation of hollow portions within the ceramic base of the shower plate, adjacent to the intermediate channels, to reduce thermal conduction to the exterior, using gases with lower thermal conductivity or maintaining a vacuum state, and employing supports to enhance heat transmission to maintain gas temperature and improve uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If intermediate channels are provided to heat process gas, then heating efficiency is improved, but heat conduction to exterior causes localized temperature drops and gas solidification
Solution Approach 1:
A hollow portion filled with inert gas (such as nitrogen or argon) is introduced as an intermediary substance between the intermediate channel and the exterior environment. This inert gas layer acts as a thermal barrier, reducing heat conduction from the heated process gas through the channel walls to the exterior, thereby preventing localized temperature drops and gas solidification while maintaining heating efficiency
Solution Approach 2:
The hollow portion is filled with inert gas to create an inert thermal environment that isolates the heated process gas from the exterior. The inert gas has lower thermal conductivity compared to air or other gases, which reduces heat loss from the intermediate channel to the surrounding structure, thus improving thermal uniformity and preventing condensation or solidification of the process gas
2Temperature
If hollow portions are added to reduce thermal conduction, then thermal uniformity is improved, but device complexity increases
Solution Approach 1:
The hollow portion serves multiple functions simultaneously: it acts as a thermal insulation barrier to improve thermal uniformity, provides structural support to the shower plate, and can be integrated with existing manufacturing processes. By combining these functions into a single structural element, the design avoids adding separate insulation components, thereby limiting the increase in device complexity
Solution Approach 2:
The hollow portion is nested within the existing structure of the shower plate, specifically positioned adjacent to the intermediate channel without requiring complete structural redesign. This nested configuration allows the thermal management function to be integrated into the existing geometry, minimizing additional complexity while achieving the desired thermal uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal uniformity of process gases, reducing the formation of solidified materials and substrate failures by minimizing heat loss from the intermediate channels, thereby improving the reliability of semiconductor processing.
Implementation Method 1
Incorporation of hollow portions within the ceramic base of the shower plate, adjacent to the intermediate channels, to reduce thermal conduction to the exterior, using gases with lower thermal conductivity or maintaining a vacuum state
Implementation Method 2
a resistance heating element, located inside the base along a first surface of the base
Data Source
AI summary
A shower plate includes a base, a resistance heating element, a channel, and a hollow portion. The base is made of ceramic and has a plate shape. The resistance heating element is located inside the base along a first surface of the base. The channel is located inside the base and includes an intermediate channel that is located between the resistance heating element and a second surface on a side opposite to the first surface of the base and extends in a planar direction of the base. The hollow portion is located adjacent to the intermediate channel in the planar direction of the base inside the base.