Multilayer Ceramic Component Shrinkage Mismatch Peeling
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Solution Overview
Problem
Multilayer ceramic electronic components face issues with side surface layers peeling from the laminate due to differences in shrinkage rates between dielectric ceramic layers and internal electrode layers during firing, affecting the structural integrity and reliability of components like capacitors and inductors.
Innovation Solution
The implementation of side surface layers and main surface layers with specific material compositions and structures on the multilayer ceramic electronic components, which are integrated to reduce peeling by matching the shrinkage rates and enhancing adhesion, along with the formation of external electrodes connected to internal electrode layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If side surface layers are provided on the side surfaces of the laminate, then the capacity and area of internal electrode layers are increased, but the side surface layers peel from the laminate due to shrinkage rate differences during firing
Solution Approach 1:
A buffer layer is introduced between the side surface layer and the laminate to act as an intermediary. This buffer layer has a shrinkage rate during firing that is between the shrinkage rates of the side surface layer and the laminate, thereby reducing the shrinkage rate difference and preventing peeling of the side surface layer.
Solution Approach 2:
The shrinkage rate of the buffer layer is specifically controlled to be between the shrinkage rates of the side surface layer and the laminate. By changing the material composition and firing characteristics of the buffer layer, its shrinkage rate is optimized to bridge the gap between the two layers with different shrinkage rates, preventing adhesion failure.
2Area of stationary object
If the thickness of side margin is reduced to increase internal electrode area, then capacity increases, but structural integrity is compromised due to peeling
Solution Approach 1:
The buffer layer serves as a mediator that maintains structural integrity by preventing peeling between the side surface layer and the laminate. This allows the side margin thickness to be reduced without compromising the overall structural strength, as the buffer layer ensures continuous adhesion throughout the component.
Solution Approach 2:
The laminate structure is enhanced by introducing a composite multi-layer configuration including the buffer layer with intermediate shrinkage characteristics. This composite structure combines materials with different properties to achieve both reduced side margin thickness and maintained structural integrity through controlled differential shrinkage.
3Reliability
If main surface layers are added to cover interfaces, then adhesion is improved, but device complexity increases
Solution Approach 1:
The laminate is segmented into functional layers with the buffer layer specifically positioned at the critical interface between the side surface layer and the main laminate. This segmentation allows the buffer layer to perform its adhesion function locally at the interface without requiring complete coverage by additional layers throughout the entire structure, thus limiting the increase in complexity.
Solution Approach 2:
The buffer layer is applied locally at the interface regions where adhesion is most critical, rather than uniformly throughout the entire laminate. This local quality approach ensures improved adhesion at the vulnerable side surface interfaces while minimizing the overall addition of layers and associated complexity in the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents side surface layers from peeling during firing, ensuring the structural integrity and reliability of multilayer ceramic components by aligning material compositions and forming integrated layers that compress the component body, thereby maintaining component functionality.
Implementation Method 1
the difference in shrinkage rate between the dielectric ceramic layers and the internal electrode layers in the laminate
Implementation Method 2
bonding a plurality of covering dielectric sheets to each other to form dielectric laminate sheets; and a step of bonding the dielectric laminate sheets to the respective side surfaces of the chip
Data Source
AI summary
A multilayer ceramic electronic component includes a laminate including dielectric ceramic layers and at least a pair of internal electrode layers laminated together, the laminate including a pair of main surfaces that oppose each other in a lamination direction, a pair of side surfaces that oppose each other in a width direction perpendicular or substantially perpendicular to the lamination direction, and a pair of end surfaces that oppose each other in a length direction perpendicular or substantially perpendicular to the lamination direction and the width direction, a pair of side surface layers respectively provided on the side surfaces of the laminate, a pair of main surface layers covering interfaces between the laminate and the side surface layers respectively provided on the main surfaces of the laminate, and a pair of external electrodes respectively connected to the internal electrode layers respectively provided on the end surfaces of the laminate.