Ceramic Structure Axial Connection Shrinkage Compensation
Solution Overview
Problem
The existing ceramic structures for plasma processing apparatuses face challenges in making direct axial connections between conductive structures like RF electrodes and heater electrodes due to differing shrinkage rates during sintering, leading to potential damage or broken connections, which limits the use of axial connections and results in increased manufacturing complexity and cost.
Innovation Solution
A ceramic structure manufacturing method that involves forming multiple layers with an electrically conductive connection member capable of compensating for the vertical shrinkage rate, allowing for axial connections between conductive structures without side effects, using a method that includes forming ceramic sheet shapes, embedding conductive structures, and sintering a laminate with a connection member that can accommodate the shrinkage difference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a vertical conductive connection member is used for axial connection in the ceramic structure, then electrical connection between conductive structures is achieved, but the conductive structure is damaged or electrical connection is broken due to difference in shrinkage rate during sintering
Solution Approach 1:
The patent introduces a shrinkage compensation member as an intermediary component between the conductive structure and the vertical conductive connection member. This member has shrinkage characteristics that match the ceramic powder, allowing it to act as a mediator that absorbs the shrinkage differential during sintering. The compensation member maintains stable length changes, preventing damage to the conductive structure while ensuring reliable electrical connection through the connection member.
Solution Approach 2:
The patent changes the shrinkage parameter of the connection structure by introducing a shrinkage compensation member with specific shrinkage characteristics that match the ceramic powder. This parameter change allows the connection structure to adapt to the ceramic's shrinkage behavior during sintering, preventing connection failure while maintaining electrical conductivity. The compensation member's shrinkage rate is specifically controlled to be substantially the same as the ceramic powder's shrinkage rate.
2Device complexity
If lateral connection structure is used between conductive structures, then manufacturing complexity is reduced, but axial connection is not achieved and separate lead wires are required increasing cost and process complexity
Solution Approach 1:
The patent segments the connection structure into multiple functional components: a shrinkage compensation member and a vertical conductive connection member. This segmentation allows each component to perform its specific function - the compensation member handles shrinkage accommodation while the connection member provides electrical conductivity. This segmented approach enables axial connection without requiring separate lead wires, simplifying the overall device structure while improving manufacturability.
Solution Approach 2:
The patent employs a composite connection structure combining materials with different properties - the shrinkage compensation member is made from ceramic powder matching the substrate material, while the vertical conductive connection member is made from electrically conductive material. This composite structure integrates both mechanical compatibility (shrinkage matching) and electrical functionality, enabling direct axial connection without additional lead wires and reducing manufacturing complexity.
3Ease of manufacture
If separate lead wires are used for electrical connection, then manufacturing process is simplified, but lifespan is shortened due to corrosion and contamination of exposed electrical connection members
Solution Approach 1:
The patent nests the vertical conductive connection member within the ceramic structure, specifically embedding it in the shrinkage compensation member that is itself part of the ceramic substrate. This nested configuration protects the conductive connection member from direct exposure to the external environment, shielding it from corrosion and contamination. The ceramic material acts as a protective barrier, extending the lifespan of the electrical connection while maintaining manufacturing simplicity.
Solution Approach 2:
The shrinkage compensation member serves as an intermediary protective layer between the vertical conductive connection member and the external environment. This intermediary ceramic structure protects the conductive member from direct exposure to corrosive and contaminating environments while still allowing electrical connection. The compensation member thus provides both functional (shrinkage matching) and protective roles, extending component lifespan without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable, cost-effective axial connections between conductive structures, improving the lifespan and reducing noise in the ceramic structure, while simplifying the connection process and maintaining structural integrity.
Implementation Method 1
a process of inserting the conductive structure in a ceramic powder state and sintering the conductive structure at a high temperature and high pressure is required. Since the high pressure is applied in an axial direction in the sintering process, the lateral shrinkage of the ceramic powder is not large, but the axial shrinkage under a large pressure occurs largely.
Implementation Method 2
embedding an electrically conductive connection member capable of compensating for a vertical shrinkage rate of the ceramic sheet shape in the ceramic sheet shape of the second layer
Data Source
AI summary
A ceramic structure including a first conductive structure embedded therein and a second conductive structure embedded at a different depth from the first conductive structure is disclosed. In the ceramic structure, the first conductive structure and the second conductive structure are electrically connected to each other by an electrically conductive connection member capable of compensating for a vertical shrinkage rate of a ceramic sheet shape while being embedded therein when sintering the ceramic structure.