Multilayer Ceramic Component Side Dielectric Layout Against Peeling
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Solution Overview
Problem
The side dielectric layers in multilayer ceramic electronic components are prone to peeling off, and existing methods to prevent peeling either increase the component size or fail to adequately address the issue.
Innovation Solution
The side dielectric layers are bent to cover specific portions of the element body, while leaving other portions uncovered, and external electrodes are formed to cover the exposed end surfaces, thereby enhancing adhesion and reducing the component's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If side dielectric layers are completely covered on the element body to prevent peeling, then adhesion is improved, but the component size increases
Solution Approach 1:
The side dielectric layers are configured to cover only specific portions of the element body - specifically the end portions in the second direction that are adjacent to the side surfaces. The central portions are intentionally left uncovered. This local differentiation allows adhesion prevention at critical locations without adding unnecessary volume throughout the entire component.
Solution Approach 2:
The coverage of side dielectric layers is segmented into covered portions (end regions adjacent to side surfaces) and uncovered portions (central regions). This segmentation strategy applies adhesion prevention measures only where peeling is most likely to occur, rather than uniformly across the entire surface, thus avoiding unnecessary size increase.
2Volume of moving object
If side dielectric layers are made thinner to reduce component size, then volume is reduced, but peeling resistance deteriorates
Solution Approach 1:
By making the side dielectric layers thin overall but strategically positioned to cover only the critical end portions adjacent to side surfaces, the design achieves adequate peeling resistance at key locations while maintaining reduced component volume. The coverage is concentrated where peeling stress is highest rather than distributed uniformly.
3Reliability
If external electrodes are formed to cover exposed end surfaces, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The side dielectric layers are configured and positioned before the formation of external electrodes. This preliminary arrangement of dielectric layers to cover specific portions creates a stable foundation that guides subsequent electrode formation, ensuring proper electrical connectivity while following a logical manufacturing sequence that minimizes overall complexity.
Data Source
AI summary
A multilayer ceramic electronic component includes an element body in which internal electrodes and dielectric layers are alternately stacked in a first direction, an element body having a pair of end surfaces, an upper surface and a lower surface, and a pair of side surfaces, a pair of side dielectric layers that cover the side surfaces, respectively, at least one of the side dielectric layers covering a first portion and not covering a second portion, the first portion being an end in a second direction of at least one of the upper surface and the lower surface and adjacent to a corresponding side surface, the second portion being a central portion in the second direction of the at least one of the upper surface and the lower surface and adjacent to the corresponding side surface, and a pair of external electrodes that cover the end surfaces, respectively.