Multilayer Ceramic Component Side-Margin Bonding Against Peeling
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Solution Overview
Problem
The peeling of side margins in multilayer ceramic electronic components is a challenge, especially as the number of stacked layers increases, leading to issues with maintaining rectangularity and potentially affecting electrical characteristics.
Innovation Solution
A multilayer ceramic electronic component design that includes a protective layer covering the capacitance forming portion and side surfaces, with particles having a specific aspect ratio and distribution to enhance bonding, and external electrodes covering the end surfaces, along with a manufacturing method that involves spraying particles onto the side surfaces before applying ceramic sheets to form side margins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked layers is increased to achieve higher capacitance, then the capacitance value is improved, but deviation occurs during stacking and rectangularity of the chip deteriorates
Solution Approach 1:
The patent divides the side margin formation into separate segments: the capacitance forming portion is cut into individual pieces, and side margins are formed by bonding separate ceramic green sheets to the side surfaces. This segmentation allows independent processing of the capacitance stack and side margin formation, maintaining rectangularity even with increased stacking layers.
2Manufacturing precision
If ceramic green sheets are bonded to form side margins to maintain rectangularity, then the shape precision is improved, but the side margins tend to peel off
Solution Approach 1:
The patent introduces an intermediate layer between the capacitance forming portion and the side margins. This intermediate layer acts as a mediator that enhances the bonding strength and prevents peeling of the side margins while maintaining the rectangular shape. The intermediate layer provides a transition zone that improves adhesion between the stacked layers and side margins.
3Reliability
If side margins are formed by bonding to suppress peeling, then the bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary actions to the capacitance forming portion before side margin bonding, including cutting into individual pieces and preparing the surfaces. These preliminary actions are designed to simplify the subsequent bonding process and ensure reliable attachment of side margins without requiring complex manufacturing steps.
Data Source
AI summary
A multilayer ceramic electronic component includes a capacitance forming portion in which dielectric layers and internal electrodes are alternately stacked along a first axis direction, the capacitance forming portion including a pair of main surfaces, a pair of side surfaces, and a pair of end surfaces, a protective layer that covers the capacitance forming portion with the main surfaces and the side surfaces as interfaces, particles that are present across the capacitance forming portion and the protective layer, and in which, when a longest portion in a cross section including a direction along the first axis direction is defined as a long side and a longest portion in portions orthogonal to the long side is defined as a short side, a ratio of the short side to the long side is equal to or less than ⅓, and external electrodes that cover at least the end surfaces, respectively.