Ceramic Circuit Component with Silica-Composite Conductors
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Solution Overview
Problem
Existing wiring boards face challenges in reducing the electrical resistance of their electrical conductor layers, particularly in high-frequency regions, due to issues with adhesion and grain growth during firing.
Innovation Solution
Incorporating silica particles with a nano-size into the electrical conductor layer, surrounded by a metal phase, enhances adhesion to the insulation layer and suppresses grain growth, resulting in a dense and low-resistance conductor layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical conductor material (metal oxide added to copper powder) is used, then the wiring board can be manufactured with standard materials, but the electrical resistance of the electrical conductor layer is high, especially in high-frequency regions
Solution Approach 1:
The electrical conductor layer uses a composite material consisting of a metal phase (copper) and silica particles. The silica particles (0.1-10 wt%) are dispersed within the metal phase to form a composite structure that reduces electrical resistance while maintaining manufacturability with standard ceramic and metal materials.
2Reliability
If the electrical conductor layer is made denser to reduce resistance, then electrical conductivity improves, but adhesion to the insulation layer may deteriorate
Solution Approach 1:
The invention changes the compositional parameters of the electrical conductor layer by incorporating silica particles at specific concentrations (0.1-10 wt%). This parameter change achieves densification to reduce resistance while the silica particles themselves provide adhesion promotion to the insulation layer, resolving the contradiction between density and adhesion.
3Reliability
If grain growth is suppressed to reduce resistance, then electrical conductivity improves, but the complexity of controlling the firing process increases
Solution Approach 1:
Silica particles act as an intermediary substance that suppresses grain growth of the metal phase during firing. The silica particles physically inhibit excessive grain growth while the metal phase forms a continuous conductive network, achieving low resistance without requiring complex firing process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of silica particles with a nano-size in the electrical conductor layer reduces electrical resistance and increases interface conductivity, especially in high-frequency regions, while maintaining strong adhesion to the insulation layer.
Implementation Method 1
enhances adhesion to the insulation layer
Implementation Method 2
reduces electrical resistance and increases interface conductivity
Data Source
AI summary
A circuit component includes an insulation layer made of a ceramic, and an electrical conductor layer extending in an inner portion of the insulation layer in at least one of a planar direction and a direction intersecting the planar direction. The electrical conductor layer includes a metal phase and silica particles. The metal phase surrounds the silica particles.