Ceramic Electronic Component Sintered Metal Layer Against Moisture
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Solution Overview
Problem
The characteristics of electronic components can be deteriorated due to moisture entry, particularly when a plating solution used in wet plating processes reaches the ceramic body.
Innovation Solution
The electronic component includes a sintered metal layer with a specific structure, comprising a first region of first crystal grains, a second region of second crystal grains with a different metal, and a third region of glass. The area ratio of the first region to the second region is greater than 1, which reduces contact between the first crystal grains and densifies the sintered metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating solution is used in wet plating, then the sintered metal layer can be formed, but moisture infiltration deteriorates the characteristics of the electronic component
Solution Approach 1:
The patent introduces a second metal as an intermediary substance between the first metal crystal grains. This second metal forms a barrier that prevents moisture and plating solution from penetrating through the sintered metal layer to the ceramic body, thereby protecting the electronic component characteristics from deterioration while maintaining the functionality of the plating layer
Solution Approach 2:
The sintered metal layer is designed as a composite structure containing at least two different metals (first metal and second metal). This composite structure creates a more effective moisture barrier compared to a single-metal structure, as the second metal fills gaps and reduces direct contact between first metal crystal grains, preventing moisture infiltration pathways
2Reliability
If the sintered metal layer is densified to reduce moisture infiltration, then reliability improves, but the structure becomes more complex
Solution Approach 1:
The patent applies local quality by concentrating the moisture-blocking function in the second metal regions distributed within the sintered metal layer. Rather than requiring uniform densification throughout the entire structure, the second metal locally addresses moisture infiltration at critical interfaces between first metal crystal grains, achieving effective moisture resistance with a relatively simple overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces characteristic deterioration of the electronic component by minimizing moisture infiltration and enhancing the sintered metal layer's density.
Implementation Method 1
a sintered metal layer disposed on the ceramic body. The sintered metal layer includes a first region including a plurality of first crystal grains including a first metal
Data Source
AI summary
An electronic component includes a ceramic body and a sintered metal layer disposed on the ceramic body. The sintered metal layer includes a first region including a plurality of first crystal grains including a first metal, a second region in contact with the first region and including a plurality of second crystal grains including a second metal different from the first metal, and a third region in contact with the second region and including glass. The sintered metal layer has an existence ratio of the first region and the second region that is larger than 1, the existence ratio being expressed by an area ratio of the first region to the second region.