Monolithic Ceramic Component Sputtered Electrodes
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Solution Overview
Problem
Existing methods for producing monolithic ceramic electronic components result in outer electrodes with large thickness, which increases the product's dimensions and affects reliability due to insufficient adhesion and plating issues, especially when trying to minimize the thickness dimension.
Innovation Solution
The use of sputtered electrode layers with metals like Mg, Al, Ti, and Cr for high adhesion and Cu, Al, or Ag for resistance, forming thin, uniform films with specific redox potentials and heat of solution properties to create small-thickness outer electrodes with improved reliability and plating resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive paste is applied to end surfaces and co-fired to form outer electrodes, then electrical connection is achieved, but electrode thickness becomes large (10 μm or more), increasing product dimensions
Solution Approach 1:
The patent changes the formation method parameter from co-firing conductive paste to sputtering deposition, and changes the material parameter from paste-based metal to sputtered metal films with specific redox potentials, achieving thin electrodes (less than 10 μm) while maintaining electrical connection reliability
Solution Approach 2:
The patent uses composite material structures with specific redox potential relationships between adjacent metal layers, where the first metal (lower redox potential) provides adhesion to ceramic and the second metal (higher redox potential) provides plating resistance, achieving both reliability and thin profile
2Length of stationary object
If conductive paste thickness is reduced to minimize product thickness, then product dimensions are reduced, but electrode continuity at edge line portions deteriorates, reducing reliability
Solution Approach 1:
The patent replaces the mechanical paste application and co-firing process with a sputtering deposition process, which can form uniform thin films even at edge line portions, ensuring electrode continuity while achieving minimal product thickness
Solution Approach 2:
The patent changes from paste-based electrode formation to sputtered metal film formation, enabling precise control of film thickness and continuity at edge portions while maintaining overall thin electrode structure
3Length of stationary object
If outer electrodes are made thin to reduce product thickness, then product dimensions are minimized, but adhesion strength to ceramic body and resistance to plating solution deteriorate
Solution Approach 1:
The patent employs composite metal layer structures where the first metal layer (with lower redox potential) provides strong adhesion to the ceramic body, and the second metal layer (with higher redox potential) provides resistance to plating solutions, achieving both thin overall thickness and high functional strength
Solution Approach 2:
The patent assigns different material properties to different layers of the outer electrode structure, with the first metal layer optimized for adhesion to ceramic and the second metal layer optimized for plating resistance, allowing each layer to perform its specific function effectively in the thin electrode structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves highly reliable, thin outer electrodes with excellent adhesion to the ceramic body, enhanced resistance to plating solutions, and improved reliability, comparable to components with larger electrodes, while reducing product thickness and ensuring stability during mounting.
Implementation Method 1
side-surface outer electrodes formed by a sputtering method on side surfaces in contact with the end surfaces of the ceramic multilayer body
Data Source
AI summary
Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about −2.36 V to about −0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.