Ceramic Submount LED Package Thermal Management
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Solution Overview
Problem
Conventional LED packages face challenges in heat dissipation and manufacturing complexity, particularly for high-power operations, where heat localization can reduce the package's lifetime and manufacturing precision is difficult to achieve with small metal parts.
Innovation Solution
A light-emitting device with a ceramic submount featuring conductive contact pads and a molded lens, designed for efficient heat dissipation and simplified manufacturing, utilizing a ceramic layer with copper and silver metallization for improved thermal management and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate metal reflector is used in high-power LED packages, then heat dissipation capability is improved, but manufacturing precision and alignment complexity deteriorate
Solution Approach 1:
The patent combines the reflector and submount into a single integrated component. The submount includes a reflective surface that directs light upward while simultaneously serving as the mounting platform for LED chips. This integration eliminates the need for separate reflector assembly, thereby maintaining heat dissipation performance while significantly simplifying manufacturing and improving alignment precision.
Solution Approach 2:
The submount performs multiple functions simultaneously: it serves as the mechanical mounting platform for LED chips, the reflective surface for light direction, and the thermal management component for heat dissipation. This multi-functionality reduces the number of separate parts needed while maintaining all required performance characteristics.
2Reliability
If multiple separate components are used in LED packages, then functional performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the reflector, submount, and mounting structure into a single integrated component. This reduces the total number of parts from multiple separate components to one unified structure, thereby maintaining functional performance while significantly reducing device complexity and manufacturing steps.
Solution Approach 2:
The integrated submount performs multiple functions that were previously distributed across separate components: mechanical support, light reflection, and thermal management. This multi-functionality maintains system performance while reducing complexity.
3Ease of manufacture
If conventional mounting methods are used for LED chips, then assembly simplicity is maintained, but thermal management efficiency deteriorates
Solution Approach 1:
The submount is constructed from composite materials with high thermal conductivity, such as metal cores or ceramic-substrate composites. These materials enable efficient heat dissipation from the LED chips while maintaining the structural integrity and ease of assembly required for manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and improved thermal management, allowing for higher power operation without overheating and simplifies the manufacturing process by reducing the complexity of aligning and mounting small metal parts.
Implementation Method 1
a ceramic submount featuring conductive contact pads and a molded lens, designed for efficient heat dissipation and simplified manufacturing, utilizing a ceramic layer with copper and silver metallization for improved thermal management
Data Source
AI summary
A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.