Ceramic Substrate Positioning via Asymmetric Through-Holes
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Solution Overview
Problem
Existing methods for manufacturing ceramic substrates struggle to achieve high positional accuracy for conductor layers on both the surface and back of ceramic substrates, leading to significant misalignment and instability in electrical characteristics.
Innovation Solution
The use of positioning portions such as continuous holes or notches with varying cross-sectional areas and shapes on the ceramic substrate, where the centers or centroids of these features are used as references to accurately position conductor layers, ensuring precise alignment and connection between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used to form conductor layers on ceramic green sheets, then the process is simple and straightforward, but the misalignment between conductor layers on the surface and back of the substrate body is significant
Solution Approach 1:
Positioning portions (through-holes or notches) are formed in advance in the ceramic green sheets before conductor layer formation. These positioning portions serve as reference features that enable accurate alignment of conductor layers on both the surface and back of the substrate body during subsequent manufacturing steps, thereby resolving the misalignment issue without complicating the overall process
Solution Approach 2:
Positioning portions act as intermediary reference features between the surface and back conductor layers. By providing visible reference points (through-holes or notches) that can be detected by image processing, these intermediaries enable precise positioning of conductor layers without requiring direct measurement or complex alignment mechanisms
2Manufacturing precision
If the same positioning reference is used for both surface and back conductor layers, then alignment accuracy improves, but the positioning structure becomes more complex
Solution Approach 1:
The positioning portions are segmented into simple geometric features (through-holes or notches) that are easy to manufacture and detect. By dividing the positioning function into discrete, simple elements rather than using a complex integrated positioning system, the patent achieves high alignment accuracy while keeping the positioning structure simple
Solution Approach 2:
The positioning portions utilize changes in physical parameters (presence of holes or notches) that are easily detectable by image processing systems. By transforming the positioning problem into a parameter detection problem (detecting hole/notch positions), the patent achieves precise alignment without requiring complex mechanical positioning mechanisms
Data Source
AI summary
A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.