Ceramic Power Module Substrate With Wire-Free Brazed Spacer Interconnects
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Solution Overview
Problem
Existing power modules face electrical safety risks due to wire bonding, which can lead to short circuits or disconnections under high-power and high-current conditions, and have limitations in heat dissipation and integration density.
Innovation Solution
A ceramic substrate with a metal layer pattern and conductive spacers bonded using a brazing filler layer, allowing direct electrical connection between semiconductor device electrodes and the substrate without wires, enhancing heat dissipation and integration capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect semiconductor device electrodes to substrate, then electrical connection is achieved, but short circuit or disconnection may occur due to high power and high current electrical energy
Solution Approach 1:
The patent extracts and removes the wire bonding component from the electrical connection system. By eliminating the wire bonding structure entirely and replacing it with a direct substrate-integrated metal layer pattern, the source of potential short circuits and disconnections is removed, thereby improving electrical connection reliability under high power and current conditions
Solution Approach 2:
The patent merges the electrical connection function directly into the substrate structure by forming metal layer patterns on the ceramic substrate. This integration combines the substrate and electrical connection elements into a unified structure, eliminating the separate wire bonding component and its associated reliability risks
2Ease of operation
If wire bonding structure is used for power movement line, then electrical connection is established, but the structure becomes a potential danger factor for the entire vehicle
Solution Approach 1:
The patent extracts the wire bonding structure from the power movement line configuration and replaces it with a substrate-integrated metal layer pattern. This removal eliminates the vulnerable wire bonding component that poses safety risks to the entire vehicle system
Solution Approach 2:
The patent introduces a brazing filler layer as an intermediary material to achieve direct bonding between the metal layer pattern and conductive spacers. This intermediary enables reliable electrical connection without requiring wire bonding, thereby eliminating vehicle safety risks while maintaining ease of operation
3Reliability
If direct bonding without wire is used to connect electrode and substrate, then wire bonding risks are eliminated, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming metal layer patterns on the ceramic substrate before mounting the semiconductor devices. The conductive spacers are also prepared in advance with bonding surfaces. This preliminary preparation simplifies the final assembly process and makes the direct bonding method manufacturable
Solution Approach 2:
The brazing filler layer serves as an intermediary that facilitates the direct bonding process between metal layer patterns and conductive spacers. This intermediary material enables reliable bonding at controlled temperatures and simplifies the manufacturing process by providing a standardized bonding interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves reliability and efficiency by eliminating wire bonding risks, enabling efficient heat dissipation and high-temperature performance while allowing for compact module design with enhanced bonding strength.
Implementation Method 1
a brazing filler layer configured to brazing-bond the metal layer pattern and the one surface of each of the conductive spacers
Data Source
AI summary
The present invention relates to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same, the power module electrically connecting, by means of a conductive spacer, an electrode of a semiconductor device and a metal layer pattern of a ceramic substrate without a wire, thereby converting rated voltage and current while removing electrical risk factors, which may be generated during wire bonding, and increasing reliability and efficiency when used with high power.