Multilayer Ceramic Substrate Cavity Pressurization via Thin Film Sealing
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Solution Overview
Problem
Conventional methods for manufacturing multilayer ceramic substrates with cavities face challenges in effectively pressurizing the bottom of the cavity, leading to potential separation and deformation of ceramic sheets and electrode layers, requiring additional alignment processes and risking damage to the electrode layer.
Innovation Solution
A method involving two pressurization processes with different pressures and durations, using flat molds to form a third sheet stack with a cavity sealed by thin films, allowing air pressure to be applied indirectly to the cavity bottom without direct contact, enabling stable adhesion and standardization of mold shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a protrusion is installed to the flat mold to pressurize the cavity bottom, then the pressurization effectiveness is improved, but the device complexity and alignment process difficulty increase
Solution Approach 1:
The mold structure is segmented into a flat mold body and a separate pressurization member that can be independently positioned and adjusted. This allows the pressurization function to be added without complicating the basic mold structure, as the pressurization member can be separately installed and adjusted to match different cavity configurations
Solution Approach 2:
A pressurization member is introduced as an intermediary element between the flat mold and the cavity bottom. This mediator transfers the pressurization force effectively to the cavity bottom without requiring direct integration of complex structures into the mold itself, simplifying the overall device while maintaining pressurization effectiveness
2Manufacturing precision
If a protrusion is installed to the flat mold, then the pressurization effectiveness is improved, but the operational convenience and alignment speed decrease
Solution Approach 1:
The pressurization member is pre-configured with positioning features and adjustment mechanisms that enable quick alignment with the cavity. This preliminary preparation of the pressurization member allows for rapid installation and alignment during operation, eliminating the need for time-consuming alignment procedures
Solution Approach 2:
The pressurization member is designed with adjustable and movable characteristics, allowing it to be dynamically positioned and adapted to different cavity configurations. This dynamic capability enables quick reconfiguration without requiring precise pre-alignment, significantly improving operational convenience and speed
3Ease of manufacture
If the cavity is formed by cutting off a portion of the sheet stack, then the cavity formation is simplified, but the electrode layer and ceramic sheets are likely to be damaged
Solution Approach 1:
The cavity is formed by creating holes in individual ceramic sheets before stacking, rather than cutting the stacked sheets. This preliminary action prevents damage to the electrode layer during cavity formation, as the electrode layer is not present when the holes are created in the ceramic sheets
Solution Approach 2:
Instead of forming the cavity after stacking the sheets (which would require cutting through the electrode layer), the cavity holes are formed in the ceramic sheets before assembly. This inverted sequence of operations eliminates the risk of electrode layer damage while maintaining cavity formation simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and stable manufacturing of multilayer ceramic substrates with cavities using flat molds, regardless of cavity shape, reducing alignment complexities and preventing electrode layer damage, while improving manufacturing efficiency and compatibility.
Implementation Method 1
A plurality of unsintered ceramic sheets having holes for the cavity is stacked on the electrode layer. The plurality of the unsintered ceramic sheets is pressurized to each other to thereby form a sheet stack in which the neighboring ceramic sheets are secured to each other.
Data Source
AI summary
In a method of manufacturing a multilayer ceramic substrate, first and second sheet stacks are formed by pressurizing a plurality of unsintered ceramic sheets, respectively. A hole is formed to penetrate through the second sheet stack. A third preliminary sheet stack is formed by positioning the second sheet stack on the first sheet stack. First and second thin films are formed at top and bottom of the third preliminary sheet stack, respectively. A third sheet stack is formed by pressurizing the first and the second thin films and the third preliminary sheet stack. The first and the second thin films are removed from the third sheet stack, thereby forming a preliminary multilayer ceramic substrate. The preliminary multilayer ceramic substrate is sintered. Accordingly, the reliability and stability of the manufacturing process for the multilayer ceramic substrate is sufficiently improved with reduced cost due to the flat molds and thin films.


