Ceramic Substrate Layout for Integrated Power and Driver Chips
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Solution Overview
Problem
Existing power modules face challenges in achieving high efficiency and miniaturization due to limitations in volume and size, particularly when separate circuits and elements are used for power semiconductor chips and drive circuits.
Innovation Solution
A ceramic substrate is designed with a dual in-line structure, featuring a ceramic base with distinct electrode patterns for mounting power semiconductor and drive IC chips, utilizing a stepped surface and via holes filled with metal filler for electrical connection, enabling integration on a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power semiconductor chips and drive circuits are implemented separately, then each circuit can be optimized independently, but the overall module volume and size increase
Solution Approach 1:
The patent merges the power semiconductor chip and drive circuit onto a single ceramic substrate. The substrate includes a first electrode pattern for mounting the power semiconductor chip and a third electrode pattern for mounting the drive integrated circuit chip, integrating previously separate circuits into one unified module, thereby reducing overall volume while maintaining independent circuit optimization capabilities
2Adaptability or versatility
If separate modules are used for power inverters and motor drive circuits, then each module can be designed for specific functions, but miniaturization becomes difficult
Solution Approach 1:
The ceramic substrate is designed as a universal platform that can accommodate both power semiconductor devices and drive circuits simultaneously. The substrate includes multiple electrode patterns (first, second, and third electrode patterns) that can mount different types of chips, enabling a single module to perform multiple functions previously requiring separate dedicated modules
3Loss of time
If a stepped surface is formed on the ceramic base to accommodate thicker electrode patterns, then bonding alignment time is reduced, but manufacturing complexity increases
Solution Approach 1:
The stepped surface is pre-formed on the ceramic base during substrate manufacturing, creating recessed regions that automatically accommodate electrode patterns of different thicknesses. This preliminary structural preparation eliminates the need for time-consuming bonding alignment adjustments, as components naturally settle into their correct positions without requiring extensive manual positioning
Data Source
AI summary
The present invention relates to a ceramic substrate and a manufacturing method therefor, the ceramic substrate comprises: a ceramic base; a first electrode pattern and a second electrode pattern formed on the upper and lower surfaces of the ceramic base; a third electrode pattern which is formed on the upper surface of the ceramic base while being spaced apart from the first electrode pattern, wherein the first electrode pattern is configured to have a power semiconductor chip mounted thereon and the third electrode pattern may be configured to have a driver IC chip mounted thereon.