Multilayer Ceramic Substrate Cooling Channels for Sintering Stability

The patent divides the multilayer ceramic substrate into separate ceramic layers with through-holes formed before lamination. By segmenting the structure and pre-forming through-holes in individual green sheets before stacking, the sintering contraction can occur more uniformly without causing overall dimensional deformation. This segmentation allows each layer to be processed independently, reducing stress concentration and preventing cracks during sintering.

The patent performs preliminary actions by forming through-holes and placing fillers in green sheets before lamination and sintering. The through-holes are created in the green sheet state using laser drilling or mechanical punching, and fillers are inserted before the final sintering process. This preliminary preparation allows the structure to accommodate sintering contraction more evenly, preventing dimensional deformation while maintaining surface quality.

The patent introduces fillers as intermediary materials placed in through-holes at electrode contact points between ceramic layers. These fillers act as stress-absorbing intermediaries that accommodate differential sintering contraction and prevent stress concentration at the electrode-ceramic interfaces. The fillers reduce the risk of delamination by providing a compliant layer that absorbs thermal and mechanical stresses during and after sintering.

The patent applies beforehand cushioning by inserting fillers into through-holes before the final sintering process. These fillers serve as pre-positioned cushioning elements that anticipate and compensate for stress concentration during sintering. The fillers are placed in advance to prevent delamination at electrode contact points, cushioning the structure against thermal and mechanical stresses that occur during heating and cooling cycles.

The patent utilizes fluid dynamics by forming through-holes that can be filled with thermally conductive materials or used as channels for fluid cooling. The through-holes create pathways that facilitate heat dissipation through conduction, convection, or phase change of fluids. This pneumatic/hydraulic approach allows high-performance components to be cooled effectively, preventing thermal runaway while maintaining high processing speeds and data capacity.

The patent creates a porous structure through through-holes that can be filled with thermally conductive fillers or used for fluid circulation. The porous architecture increases surface area for heat transfer and provides channels for coolant flow, enabling efficient thermal management of high-density electronic components. This porous design allows heat to be dissipated through multiple pathways, preventing overheating while maintaining high component integration.