Ceramic Substrate Corner Curvature for Impact-Resistant Housing
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Solution Overview
Problem
Conventional electronic devices with ceramic substrates are prone to damage and cracking at the corner portions due to external impacts, as these areas are exposed and lack adequate protection.
Innovation Solution
A ceramic substrate with a housing part featuring a recessed portion and side wall portions that surround the substrate, along with gaps between them, and corner portions curved inwardly to reduce exposure and enhance heat dissipation, while maintaining the substrate's corner portions exposed for protection and efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the corner portion of the substrate is exposed in the housing part, then the substrate can be accommodated with simplified structure, but the corner portion becomes vulnerable to damage from external impacts
Solution Approach 1:
The corner portions of the substrate are formed with a curved shape having a radius of curvature R1, rather than sharp corners. This curvature distributes stress more evenly during external impacts, preventing stress concentration at the corner points and thereby suppressing chipping and cracking while maintaining the exposed configuration in the housing part.
2Temperature
If the corner portion of the substrate is exposed, then heat dissipation can be improved, but the corner portion is more susceptible to damage during external impacts
Solution Approach 1:
The curved corner portions with radius of curvature R1 maintain exposure to facilitate heat dissipation while the rounded geometry inherently resists impact damage by distributing mechanical stress. This allows the substrate to simultaneously achieve effective thermal management and impact resistance without requiring additional protective structures.
3Ease of manufacture
If the corner portion of the substrate is exposed, then the substrate can be easily accommodated in the housing part, but chips and cracks may occur in the corner portion when receiving impact from outside
Solution Approach 1:
The substrate corner portions are formed with a curved shape having a radius of curvature R1, which maintains ease of accommodation in the housing part while significantly improving corner strength. The curved geometry eliminates stress concentration points, preventing chipping and cracking during impact without requiring complex protective structures or additional manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses damage to the substrate's corner portions during external impacts and improves heat dissipation, maintaining the substrate's mechanical strength and thermal conductivity while ensuring reliable operation in vibration environments.
Implementation Method 1
The substrate includes a plurality of corner portions curved toward an inner side of the circuit forming surface in a plan view
Implementation Method 2
Since a substrate made of a ceramic has superior insulating properties, superior thermal conductivity
Data Source
AI summary
An electronic device (1, and 1A to 1E) according to the present disclosure include a substrate (10, and 10F) made of a ceramic and a housing part (21) including a recessed portion (210) accommodating the substrate. The recessed portion includes a plurality of side wall portions (211) arranged around the substrate along a circumferential direction and respectively facing a plurality of sides (111) of the substrate in a plan view when viewing the substrate from a direction perpendicular to a circuit forming surface (110) of the substrate, and a plurality of gaps (212) each located between two of the plurality of side wall portions adjacent to each other in the circumferential direction. The substrate includes a plurality of corner portions (112) curved toward an inner side of the circuit forming surface in a plan view.