Ceramic Substrate Socket Structure for Corner Impact Resistance
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Solution Overview
Problem
Conventional lighting devices with exposed corner portions of ceramic substrates are prone to damage from external impacts, leading to chips and cracks.
Innovation Solution
A lighting device design featuring a socket with a recessed portion and side wall portions that face and protect the substrate's sides, while gaps between these portions allow corner portions to be exposed, reducing the risk of damage and enhancing heat dissipation through inverted-R shaped corner portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the corner portion of the substrate is exposed in the socket, then heat dissipation is improved, but the substrate corner becomes vulnerable to damage from external impacts
Solution Approach 1:
The corner portion of the substrate is formed with an inverted-R shape (curved surface) instead of a sharp corner. This curvature distributes stress more evenly and prevents stress concentration that would occur at sharp corners, thereby reducing the likelihood of chips and cracks while maintaining the exposed configuration for heat dissipation
2Device complexity
If the corner portion of the substrate is exposed in the socket, then structural simplicity is maintained, but damage risk increases under vibration and impact
Solution Approach 1:
The substrate has different geometries at different locations: the corner portion has an inverted-R shape for damage resistance, while the main body remains flat for electrical component mounting. This local differentiation addresses the specific vulnerability of corners without complicating the overall simple socket structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses damage to the corner portions of the substrate while maintaining exposure, improving reliability in vibration environments and heat dissipation.
Implementation Method 1
Since a substrate made of a ceramic has superior insulating properties, superior thermal conductivity
Data Source
Figure 1~2
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AI summary
An electronic device (1, and 1A to IE) according to the present disclosure include a substrate (10, and 10F) made of a ceramic and a housing part (21) including a recessed portion (210) accommodating the substrate. The recessed portion includes a plurality of side wall portions (211) arranged around the substrate along a circumferential direction and respectively facing a plurality of sides (111) of the substrate in a plan view when viewing the substrate from a direction perpendicular to a circuit forming surface (110) of the substrate, and a plurality of gaps (212) each located between two of the plurality of side wall portions adjacent to each other in the circumferential direction. The substrate includes a plurality of corner portions (112) curved toward an inner side of the circuit forming surface in a plan view.