Ceramic Substrate Edge Protrusions for Crack-Resistant Bonding
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Solution Overview
Problem
Ceramic AMB substrates face issues with crack formation and metal layer separation due to sudden temperature changes, and dimple-type substrates compromise electrical characteristics and bonding strength to address these issues while increasing costs and complexity.
Innovation Solution
A method of manufacturing ceramic substrates with inclined protrusions on the metal layer's perimeter, specifically multi-step and tapered inclined protrusions within a set angle range, to enhance bonding strength and facilitate etching processes, thereby improving electrical characteristics and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dimples are formed along the edge of the metal layer to prevent cracks and separation, then crack resistance and separation resistance improve, but the metal layer area decreases, resulting in deterioration of electrical characteristics
Solution Approach 1:
The invention segments the metal layer edge into multiple inclined protrusions at different heights and positions. This segmentation allows the edge to better accommodate thermal expansion differences between the metal layer and ceramic base material, preventing cracks and separation while maintaining the integrity and area of the metal layer for electrical conductivity.
Solution Approach 2:
The invention introduces a vertical dimension by creating inclined protrusions with different heights along the metal layer edge. This multi-level structure provides additional degrees of freedom for stress distribution and thermal expansion accommodation, enabling crack prevention without reducing the horizontal area of the metal layer.
2Reliability
If expensive ceramic materials like Si3N4 and SiC are used to prevent internal cracks and separation, then crack resistance improves, but product cost increases and competitiveness decreases
Solution Approach 1:
The invention changes the geometric parameters of the metal layer edge by creating inclined protrusions with specific angles and heights. This parameter modification improves crack resistance through better stress distribution and thermal expansion accommodation, eliminating the need to switch to expensive ceramic materials like Si3N4 and SiC.
3Ease of manufacture
If the metal layer edge is formed to be inclined inward to simplify manufacturing, then ease of manufacture improves, but crack resistance deteriorates under sudden temperature changes
Solution Approach 1:
The invention segments the inclined edge into multiple inclined protrusions at different heights and positions. This segmentation maintains the manufacturing simplicity of inclined structures while improving crack resistance by distributing stress across multiple levels and positions along the edge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases the metal layer's area, enhancing crack and separation resistance, maintaining strong bonding strength, and enabling application to fine patterns with reduced post-processing costs and improved reliability.
Implementation Method 1
a metal such as copper is brazed to a surface of a ceramic base material 10 to form a metal layer 20
Implementation Method 2
a certain portion of a perimeter of the metal layer 20 is etched with an etchant
Data Source
AI summary
The present invention is a method of manufacturing a ceramic substrate, the method including forming a mask on one surface of a metal layer, forming an inclined protrusion by etching the metal layer exposed by the mask, and bonding the metal layer on which the inclined protrusion is formed to a ceramic base material, and according to the present invention, the inclined protrusion is formed on an outer perimeter of the metal layer bonded to the ceramic base material to increase a bonding strength between the ceramic base material and the metal layer and facilitate a metal layer etching process.