Selective Metallization of Ceramic Substrates via Energy Beam Activation
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Solution Overview
Problem
The existing methods for forming a three-dimensional circuit on ceramic substrates are tedious and result in low adhesive force between the ceramic substrate and the metal plating layer, along with high costs.
Innovation Solution
A method involving molding and sintering a ceramic composition with dispersed functional powders, followed by energy beam radiation to create a chemical plating active center, and subsequent chemical plating to form a metal layer on the ceramic substrate, enhancing adhesive force and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface treatment methods (oil removing, mechanical roughening, chemical roughening, sensitizing and activating) are used to form a three-dimensional circuit on ceramic substrate, then the circuit can be formed, but the adhesive force between ceramic substrate and metal plating layer is low and the process is tedious
Solution Approach 1:
The functional powder is pre-dispersed into the ceramic powder before sintering, so that after sintering the functional powder forms reactive sites (chemical plating active centers) directly on the ceramic substrate surface. This preliminary preparation eliminates the need for subsequent surface treatment steps (oil removing, mechanical roughening, chemical roughening, sensitizing and activating) while ensuring good adhesion for chemical plating.
Solution Approach 2:
The invention combines the ceramic substrate formation and the creation of chemical plating active centers into a single sintering process. The functional powder is mixed with ceramic powder before sintering, merging the substrate fabrication and surface activation steps that were previously separate processes.
2Reliability
If conventional metallizing methods are used on ceramic substrate, then metal plating layer can be formed, but the cost is high
Solution Approach 1:
The functional powder is pre-dispersed into the ceramic powder before sintering, so that after sintering the functional powder forms reactive sites (chemical plating active centers) directly on the ceramic substrate surface. This preliminary preparation eliminates the need for subsequent surface treatment steps (oil removing, mechanical roughening, chemical roughening, sensitizing and activating) while ensuring good adhesion for chemical plating.
Solution Approach 2:
The invention combines the ceramic substrate formation and the creation of chemical plating active centers into a single sintering process. The functional powder is mixed with ceramic powder before sintering, merging the substrate fabrication and surface activation steps that were previously separate processes.
3Reliability
If high sintering temperature is used to sinter ceramic composition, then dense ceramic substrate can be obtained, but energy consumption is high
Solution Approach 1:
The introduction of functional powder changes the sintering parameters required. The functional powder acts as a sintering aid that lowers the sintering temperature needed to achieve dense ceramic substrates with good mechanical performance, thereby reducing energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a high adhesive force between the metal plating layer and the ceramic substrate while reducing the sintering temperature and energy requirements, resulting in improved mechanical performance and cost-effectiveness.
Implementation Method 1
radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center
Implementation Method 2
performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer
Data Source
AI summary
A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.