Ceramic Substrate Insulation Structure for Narrow-Gap Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor modules using ceramic substrates face insulation issues between conductor patterns due to delamination caused by thermal stress, hindering further miniaturization.
Innovation Solution
A semiconductor module with a ceramic substrate and conductor patterns is enhanced by an insulating member extending in the gap between conductor patterns, adhered with a high-adhesion adhesive, to ensure insulation and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a single insulating resin is used to seal the wiring board and semiconductor element, then the insulation between conductor patterns is achieved and the module size is reduced, but delamination occurs at the interface between ceramic substrate and insulating resin due to thermal stress
Solution Approach 1:
The insulating structure is segmented into two distinct parts: a first insulating resin for sealing the wiring board and semiconductor element, and a second insulating resin specifically applied to fill the gap between adjacent conductor patterns. This segmentation allows each resin to perform its specialized function, preventing delamination while maintaining insulation reliability.
Solution Approach 2:
Different insulating resins are applied to different locations with specific properties tailored to each region's requirements. The first insulating resin provides general sealing, while the second insulating resin provides localized gap filling and insulation between conductor patterns, ensuring optimal performance in each specific area.
2Length of moving object
If the distance (gap) between conductor patterns is narrowed for miniaturization, then the module size is reduced, but insulation between conductor patterns cannot be ensured due to delamination
Solution Approach 1:
The second insulating resin is applied in advance to fill the gap between adjacent conductor patterns before the final sealing process. This preliminary action ensures that the gap is pre-filled with appropriate insulating material, preventing delamination and ensuring insulation reliability even when the gap distance is minimized for miniaturization.
Solution Approach 2:
The insulating structure uses a composite approach with two different insulating resins having distinct properties. The first insulating resin provides structural sealing, while the second insulating resin provides specialized gap filling and electrical insulation between conductor patterns, creating a composite insulating system that addresses both miniaturization and reliability requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulating member maintains insulation between conductor patterns, allowing for further miniaturization of the semiconductor module by preventing delamination and ensuring reliable electrical connectivity.
Implementation Method 1
the insulating member may be adhered to said ceramic substrate with an insulating adhesive
Data Source
AI summary
A semiconductor module includes: a wiring board including a ceramic substrate and conductor patterns on a first surface of the ceramic substrate; a semiconductor element arranged on at least one of the conductor patterns on the first surface of the ceramic substrate; a sealing insulator that seals the wiring board and the semiconductor element; and an insulating member disposed on the first surface of the ceramic substrate in a gap between the conductor patterns that are adjacent to each other, the insulating member extending in an extending direction of the gap and dividing an area in the gap where the sealing insulator fills the gap so that the insulating member is separate from respective edges of the conductor patterns adjacent to each other.