Crystal-Grown Ceramic Substrate Composite for Low-Loss Thin Circuits
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Solution Overview
Problem
Conventional ceramic substrates formed by the co-sintered method suffer from issues like undesired holes, deformation, limited thickness reduction, increased costs, and high high-frequency signal attenuation, making them unsuitable for refined circuit boards and future communication applications.
Innovation Solution
A composite structure comprising a first ceramic substrate formed by crystal growth with vertically filled via holes and a thin film substrate, optionally with a heat insulating layer and a second ceramic substrate, providing electrical connections and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the co-sintered method is used to form ceramic substrates, then the substrate can be manufactured with conventional processes, but undesired holes and residual stress are formed after sintering
Solution Approach 1:
The patent changes the manufacturing method from co-sintering to crystal growth method, fundamentally altering the process parameters to eliminate hole formation and residual stress while achieving precise substrate formation without deformation
Solution Approach 2:
The patent uses a composite structure combining ceramic substrate material with a film substrate, creating a new material system that avoids the defects of conventional co-sintered ceramic substrates while maintaining manufacturability
2Ease of manufacture
If the co-sintered method is used for ceramic substrates, then existing fabrication processes can be maintained, but thickness cannot be reduced and costs greatly increase for refined circuits
Solution Approach 1:
The patent adopts crystal growth method instead of co-sintering, enabling precise control over substrate thickness and allowing reduction to ultra-thin dimensions while maintaining manufacturing feasibility and reducing costs for refined circuit applications
3Quantity of substance
If conventional ceramic substrates with lower dielectric constant than FR4 are used, then material cost may be reduced, but decay rate of high-frequency signals is still too high for 5G millimeter-wave applications
Solution Approach 1:
The patent creates a composite structure with ceramic substrate and film substrate that achieves both low dielectric constant and low signal decay rate, making it suitable for 5G millimeter-wave high-frequency applications while maintaining cost effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite structure eliminates hole formation and residual stress, reduces high-frequency signal attenuation, and enables the creation of precise, ultra-thin circuit boards with enhanced heat dissipation and robustness, suitable for high-end packaging applications.
Implementation Method 1
a first ceramic substrate formed by crystal growth... providing electrical connections and improved thermal conductivity
Implementation Method 2
a heat insulating layer disposed between the second surface of the first ceramic substrate and the thin film substrate to isolate heats from the external element or the circuit board
Data Source
AI summary
A composite structure of a ceramic substrate, including a first ceramic substrate formed by crystal growth, which has a first surface and a second surface opposite to each other, and has only vertical via holes filled with conductive material, so that the first surface and the second surface of the first ceramic substrate are electrically connected; and a thin film substrate disposed on the second surface of the first ceramic substrate, and one of the surfaces is electrically connected to the second surface of the first ceramic substrate, and an electrical connection point is provided on the other surface of the thin film substrate to electrically connect an external element or another circuit board.