Ceramic Carrier Substrate With Metal Core for Compact Cooling
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Solution Overview
Problem
Carrier substrates with ceramic primary layers face challenges in size, weight, cooling performance, electromagnetic compatibility, and parasitic inductances, often requiring large cooling structures that increase material usage and manufacturing costs.
Innovation Solution
A carrier substrate design featuring a ceramic primary layer with a metallic intermediate layer thicker than both the primary and secondary layers, enhancing heat distribution and thermal resistance, while reducing the need for oversized cooling structures and improving mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large cooling structures are used to provide sufficient thermal capacity, then cooling performance is improved, but device size and material usage increase
Solution Approach 1:
The patent changes the material parameter from ceramic to metal for the intermediate layer, exploiting the higher thermal conductivity of metal materials to improve heat dissipation efficiency and reduce the required cooling structure size
Solution Approach 2:
The patent creates a composite structure combining ceramic primary layer with metal intermediate layer and secondary layer, utilizing the complementary properties of different materials (ceramic insulation + metal conduction) to optimize both thermal management and electrical isolation
2Temperature
If large cooling structures are used to provide sufficient thermal capacity, then cooling performance is improved, but weight increases
Solution Approach 1:
The patent changes the material parameter from ceramic to metal for the intermediate layer, exploiting the higher thermal conductivity of metal materials to improve heat dissipation efficiency and reduce the required cooling structure size
Solution Approach 2:
The patent creates a composite structure combining ceramic primary layer with metal intermediate layer and secondary layer, utilizing the complementary properties of different materials (ceramic insulation + metal conduction) to optimize both thermal management and electrical isolation
3Reliability
If thick ceramic primary layers are used for electrical insulation, then electrical insulation strength is improved, but thermal resistance increases
Solution Approach 1:
The patent introduces a metal intermediate layer as a mediator between the ceramic primary layer and secondary layer, providing a high-conductivity thermal pathway that bypasses the thermal resistance of the ceramic layer while maintaining electrical insulation
Solution Approach 2:
The patent changes the material parameter from ceramic to metal for the intermediate layer, exploiting the higher thermal conductivity of metal materials to improve heat dissipation efficiency and reduce the required cooling structure size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal resistance by up to 30%, reduces material usage and manufacturing costs, and enhances mechanical stability, allowing for a more compact and efficient cooling system with improved electromagnetic compatibility.
Implementation Method 1
a metallic intermediate layer being arranged between the primary layer and the secondary layer for heat transfer from the component side to the cooling side
Data Source
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AI summary
The invention relates to a carrier substrate (1) for electric components (13), comprising a component side (4) and, on the side opposite the component side (4), a cooling side (5) having a cooling structure (30); the carrier substrate (1) has a ceramic primary layer (10) facing the component side (4) in order to provide electric insulation, and a secondary layer (20) facing the cooling side (5) in order to reinforce the carrier substrate (1). The invention is characterized in that in order to allow for heat transfer from the component side (4) to the cooling side (5), an intermediate metal layer (15) which is thicker than the primary layer (10) and/or the secondary layer (20) is placed between the primary layer (10) and the secondary layer (20).