Ceramic substrate for power module, method for manufacturing same, and power module having same
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Solution Overview
Problem
Existing power modules face challenges with wire bonding, including the risk of short circuits, disconnections, and inadequate heat dissipation due to high power and current electrical energy, which can lead to safety issues and reduced reliability.
Innovation Solution
A ceramic substrate with protrusion type electrodes integrated into the electrode pattern, where the electrodes are bonded to semiconductor devices without wire bonding, allowing for improved electrical conductivity and enhanced heat dissipation by transferring heat generated from semiconductor devices to the ceramic substrate through the protrusion type electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect semiconductor devices to substrates, then electrical connection can be achieved, but reliability deteriorates due to potential short circuits and disconnections under high power and current conditions
Solution Approach 1:
The protrusion type electrode integrates the connection function and heat dissipation function into a single structure. The electrode protrudes from the substrate surface to directly contact the semiconductor device electrode, eliminating the need for separate wire bonding while providing both electrical connection and heat dissipation pathways.
Solution Approach 2:
The harmful wire bonding structure is completely removed from the system. The patent extracts the problematic intermediate connection method (wire bonding) and replaces it with a direct contact structure through protrusion type electrodes that are integral to the substrate, thereby eliminating the sources of short circuits and disconnections.
2Temperature
If wire bonding is used for electrical connection, then device assembly can be completed, but heat dissipation efficiency deteriorates due to inadequate thermal management under high power conditions
Solution Approach 1:
The protrusion type electrode merges the electrical connection function and heat dissipation function into a single integrated structure. The same protruding electrode that provides electrical contact also serves as a heat conduction path, transferring heat from the semiconductor device to the substrate effectively.
Solution Approach 2:
The protrusion type electrode performs multiple functions simultaneously: it provides electrical connection between the substrate and semiconductor device, serves as a heat dissipation path, and maintains mechanical stability. This multi-functional design eliminates the need for separate wire bonding structures.
3Temperature
If protrusion type electrodes are formed by half-etching the electrode pattern, then heat dissipation efficiency is maximized, but manufacturing complexity increases due to additional etching steps
Solution Approach 1:
The electrode pattern is first formed on the substrate surface through standard photolithography and etching processes. Then, a photoresist mask is applied to protect the regions where protrusions should remain. The half-etching process selectively removes material from non-masked regions, creating the protrusion structure. This preliminary formation of the base electrode pattern simplifies the overall process by establishing the foundation before adding the protrusion feature.
Solution Approach 2:
The electrode pattern is divided into two functional regions: masked regions that remain as protrusion type electrodes for direct semiconductor contact and heat dissipation, and unmasked regions that are etched away to form the substrate surface. This segmentation allows the same electrode pattern to serve both connection and heat dissipation functions through differential etching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves electrical conductivity and reliability by eliminating wire bonding hazards and maximizes heat dissipation efficiency, enabling stable voltage and current conversion and efficient heat transfer from both surfaces of semiconductor devices.
Implementation Method 1
brazing-bonding the brazing filler layer by melting the brazing filler layer
Implementation Method 2
forming a photoresist pattern by exposing and developing the photoresist
Implementation Method 3
transferred heat generated from semiconductor devices to the ceramic substrate through the protrusion type electrodes
Data Source
AI summary
The present invention pertains to a ceramic substrate for a power module, a method for manufacturing same, and a power module having same. By forming a protruding electrode integrated with an electrode pattern, the ceramic substrate can improve electrical conductivity when bonded to an electrode of a semiconductor device, can stably convert rated voltage and current while eliminating electrical hazards that can occur during wire bonding, and can improve reliability and efficiency when used in high power applications.