Ceramic Substrate Resist Pattern for Solder Spread Prevention
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Solution Overview
Problem
Existing methods for manufacturing ceramic substrates fail to prevent solder from spreading between electrodes when electronic components are mounted, as they do not effectively coat interelectrode wires with a cover coating, leading to inefficiencies in the mounting process.
Innovation Solution
A ceramic substrate design that includes electrodes and interelectrode wires on the electronic component mounting surface, with a resist pattern extending across the interelectrode wires to prevent solder spread, and a manufacturing method involving a resist sheet with a resist pattern that is pressure-bonded and transferred to ensure the resist covers the interelectrode wires, maintaining coplanarity and preventing resist spread.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resist pattern is applied to coat electrodes and interelectrode wires, then solder spread is prevented, but the resist pattern spreads due to steps formed by electrodes and interelectrode wires
Solution Approach 1:
The patent applies a first resist pattern before forming interelectrode wires, and then applies a second resist pattern after wire formation. This preliminary action of coating electrodes before wire placement prevents the resist from encountering height differences later, eliminating the spreading problem while maintaining effective solder protection.
Solution Approach 2:
The patent divides the resist coating process into two separate stages: first coating electrodes before wire formation, and second coating after wire formation. This segmentation allows each resist application to occur on a flat surface without steps, preventing resist spread while ensuring complete coverage of both electrodes and interelectrode wires.
2Productivity
If interelectrode wires are not coated with covers, then the mounting process is simpler, but solder spreads out between the electrodes when components are mounted
Solution Approach 1:
The patent applies a resist pattern before forming interelectrode wires, creating a preliminary protective layer that extends across the entire mounting surface. This preliminary action ensures that when components are mounted later, the solder is contained by the pre-formed resist barriers, maintaining reliability without complicating the mounting process.
Solution Approach 2:
The resist pattern serves multiple functions: it acts as a cover coating for electrodes to prevent solder spread, and simultaneously provides a flat mounting surface for electronic components. This multi-functionality maintains mounting efficiency while ensuring solder containment across the entire substrate surface.
3Reliability
If the upper surface of the resist is not flat, then the resist can conform to the interelectrode wires, but the work efficiency when mounting electronic components decreases
Solution Approach 1:
The patent applies the first resist pattern before interelectrode wires are formed, when the surface is still flat. This preliminary application ensures complete coverage of electrodes without creating height differences. After wires are formed, a second resist pattern is applied to provide additional coverage, maintaining both reliability and productivity.
Solution Approach 2:
The patent transitions from a single-layer resist approach to a two-layer resist system applied at different stages of manufacturing. This dimensional change in the process sequence allows each resist layer to be applied on a flat surface, ensuring both complete coverage and a final flat mounting surface for high efficiency component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents solder spread between electrodes, enhances mounting efficiency by maintaining coplanarity, and ensures better transmission characteristics through optimized interelectrode wire design.
Implementation Method 1
disposing and pressure-bonding the resist sheet so that the resist pattern overlaps with the electronic component mounting surface of the ceramic green sheet, and separating the resist sheet to transfer the resist so that the resist on the resist sheet extends across the interelectrode wire
Data Source
AI summary
A ceramic substrate according to the present disclosure includes a plurality of electrodes on an electronic component mounting surface, and one or more interelectrode wires that connect the electrodes to each other on the electronic component mounting surface. A resist that extends across the interelectrode wire is disposed on the electronic component mounting surface.