Ceramic Substrate Tempering Device With Segmented Cooling Channels

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Solution Overview

Problem

Existing substrate holding devices face challenges in achieving homogeneous temperature distribution and effective temperature control, often resulting in electrical interference that affects measurements.

Innovation Solution

A two-part ceramic substrate tempering device with a cavity system for temperature control fluid flow, featuring a meandering channel design and electrically conductive shielding layers to ensure homogeneous temperature distribution and interference shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling channels are formed in a ceramic body, then cooling of the substrate is achieved, but homogeneous temperature distribution becomes difficult to achieve

Engineering Contradiction:
Improvesubstrate coolingVSAvoidtemperature distribution homogeneity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The device is divided into two separate partial elements (first and second) that are joined together. The cooling channels are formed in the first partial element while the contact surface is provided by the second partial element. This segmentation allows independent optimization of cooling efficiency and temperature homogeneity, resolving the contradiction between achieving effective cooling and maintaining uniform temperature distribution across the substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A fluid-tight connecting layer is introduced as an intermediary between the first and second partial elements. This connecting layer serves as a mediator that transmits thermal energy while maintaining fluid tightness for the cooling channels. The connecting layer enables the cooling fluid to flow through channels in the first element while the second element provides a stable contact surface, achieving both effective cooling and homogeneous temperature distribution.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If electrical heating and cooling elements are used, then temperature control is achieved, but electrical interference signals affect measurements

Engineering Contradiction:
Improvesubstrate temperature controlVSAvoidelectrical interference
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The invention replaces electrical heating and cooling elements with a mechanical/thermal system using cooling channels through which temperature control fluid flows. This substitution eliminates the electrical interference signals that would affect substrate measurements, while still achieving effective temperature control through the thermal exchange between the cooling fluid and the substrate via the ceramic structure.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Device complexity

If a one-piece ceramic body is used, then device simplicity is achieved, but temperature control fluid flow paths are limited

Engineering Contradiction:
Improvedevice structureVSAvoidcooling channel configuration
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The device is segmented into two joinable partial elements, which paradoxically increases structural flexibility. The first partial element can be designed with various cooling channel configurations (spiral, parallel, meandering, counter-rotating) while the second element provides the contact surface. This segmentation allows diverse cooling channel designs to be implemented without compromising the overall device simplicity, resolving the contradiction between structural simplicity and configuration versatility.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device provides precise and homogeneous temperature control, reducing electrical interference and enhancing the accuracy of substrate measurements.

Implementation Method 1

at least one recess is provided in at least one of the two connecting surfaces, which recess defines at least one cavity in the device... allowing a temperature control fluid inflow and/or outflow to and/or from the at least one cavity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP1866654B1Method and device for tempering a substrate
Publication Date: 2012.06.20 ATT ADVANCED TEMPERATURE TEST SYST GMBH
  • EP1866654B1 patent drawingFigure 1
  • EP1866654B1 patent drawingFigure 2A~2C

AI summary

The invention concerns a device and a method for tempering a substrate (S), as well as a method for making such a device, which comprises the following elements: a first subelement (10) provided with a support surface (20) to be pressed against the substrate (S) and with a first connecting surface, a second subelement (12) provided with a second connecting surface (28) whereby it is pressed at least partly against the first connecting surface (10). At least one of the two subelements (10, 12) contains a ceramic material. At least one of the two connecting surfaces (22, 28) comprises at least one recess (24, 30) which defines at least one cavity (32) in the device. At least one first connecting opening enables a thermostatic liquid to be circulated and/or supplied towards and/or from the cavity (32).