Ceramic Substrate Conductor Pattern for Lower-Temperature Tungsten Sintering

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Solution Overview

Problem

Existing technologies face challenges in sintering tungsten due to its high melting point, necessitating the use of materials that are difficult to obtain as sintering aids, limiting the choices available for sintering aids.

Innovation Solution

The use of solid solutions with body-centered cubic lattice structures, where cobalt and iron, silicon, manganese, or nickel are solid-dissolved in tungsten, as alternative sintering aids, allowing for easier sintering of tungsten at lower temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional sintering aids (nickel oxide, aluminum oxide, silicon dioxide) are used to sinter tungsten, then tungsten can be sintered, but the sintering temperature remains very high and the sintering aids are difficult to obtain

Engineering Contradiction:
ImproveAvailability of sintering aidsVSAvoidSintering temperature
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The invention changes the chemical composition parameters of the sintering aid system by introducing new materials (zirconium oxide, hafnium oxide, tantalum oxide) that form solid solutions with tungsten, thereby modifying the sintering behavior to achieve lower sintering temperatures while maintaining material availability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses composite sintering aid systems comprising multiple oxides (zirconium oxide-hafnium oxide-tantalum oxide combinations) that work synergistically to facilitate tungsten sintering at lower temperatures, replacing the need for difficult-to-obtain traditional sintering aids

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If tungsten is sintered under the same conditions as ceramic, then the ceramic substrate can be formed, but the sintering temperature must be extremely high due to tungsten's high melting point

Engineering Contradiction:
ImproveIntegration of conductor pattern with ceramic base bodyVSAvoidSintering temperature
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The invention introduces new sintering aid oxides as intermediary materials that facilitate the sintering of tungsten particles during the ceramic substrate formation process, enabling the conductor pattern to be integrated with the ceramic base body at lower temperatures by mediating the bonding process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention modifies the thermal processing parameters by using sintering aid oxides that lower the effective sintering temperature, allowing simultaneous formation of the ceramic matrix and metallurgical bonding of the tungsten conductor pattern without requiring extremely high temperatures

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the successful sintering of tungsten at temperatures significantly lower than its melting point, facilitating the production of ceramic substrates with embedded electrical conductor patterns, enhancing the manufacturing process efficiency.

Implementation Method 1

The electrical conductor pattern has, as a main component, a solid solution having a body-centered cubic lattice structure in which cobalt and iron are solid-dissolved in tungsten, a solid solution in a body-centered cubic lattice structure in which cobalt and silicon are solid-dissolved in tungsten, a solid solution having a body-centered cubic lattice structure in which cobalt and manganese are solid-dissolved in tungsten, or a solid solution having a body-centered cubic lattice structure in which cobalt and nickel are solid-dissolved in tungsten

Methodology Applied
Scientific EffectSolid solution: Solid Solution Strengthening

Data Source

PatentUS12431379B2Ceramic substrate, method of manufacturing the ceramic substrate, electrostatic chuck, substrate fixing device, and package for semiconductor device
Publication Date: 2025.09.30 SHINKO ELECTRIC IND CO LTD
  • US12431379B2 patent drawing
  • US12431379B2 patent drawing
  • US12431379B2 patent drawing

AI summary

A ceramic substrate includes a base body and an electrical conductor pattern embedded in the base body. The base body is a ceramic. The electrical conductor pattern has, as a main component, a solid solution having a body-centered cubic lattice structure in which cobalt and iron are solid-dissolved in tungsten, a solid solution in a body-centered cubic lattice structure in which cobalt and silicon are solid-dissolved in tungsten, a solid solution having a body-centered cubic lattice structure in which cobalt and manganese are solid-dissolved in tungsten, or a solid solution having a body-centered cubic lattice structure in which cobalt and nickel are solid-dissolved in tungsten.