Ceramic Substrate Brazing Layout for Warpage Suppression
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Solution Overview
Problem
Ceramic substrates used for mounting high-power transistors in electric motors face warpage issues when the heat dissipation plate or circuit plate is made thicker to enhance heat dissipation, as existing methods do not effectively manage the thickness difference between these components.
Innovation Solution
A ceramic substrate design featuring a flat ceramic insulating base with varying thicknesses of metal circuit and heat dissipation plates, and corresponding brazing material layers, where the thickness of one brazing material layer is greater than the other to counteract warpage, allowing for increased thickness without warping, and the substrate can be divided into multiple pieces for application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the heat dissipation plate is increased to improve heat dissipation properties, then thermal conductivity is improved, but warpage occurs during manufacturing
Solution Approach 1:
The patent applies asymmetry by making the brazing material layer thicknesses asymmetric - the first brazing material layer (between circuit plate and insulating base) has a different thickness than the second brazing material layer (between heat dissipation plate and insulating base). This asymmetric design compensates for the thickness difference between the heat dissipation plate and circuit plate, preventing warpage while maintaining improved heat dissipation properties.
Solution Approach 2:
The patent changes the parameter of brazing material layer thickness to resolve the contradiction. By adjusting the thickness of the first and second brazing material layers differently, the patent compensates for the increased heat dissipation plate thickness, thereby preventing warpage while maintaining the improved thermal conductivity.
2Reliability
If the thickness of the circuit plate is increased to increase current flowing capacity, then electrical conductivity is improved, but warpage occurs during manufacturing
Solution Approach 1:
The patent applies asymmetry by making the brazing material layer thicknesses asymmetric - the first brazing material layer (between circuit plate and insulating base) has a different thickness than the second brazing material layer (between heat dissipation plate and insulating base). This asymmetric design compensates for the thickness difference between the circuit plate and heat dissipation plate, preventing warpage while maintaining improved current flowing capacity.
Solution Approach 2:
The patent changes the parameter of brazing material layer thickness to resolve the contradiction. By adjusting the thickness of the first and second brazing material layers differently, the patent compensates for the increased circuit plate thickness, thereby preventing warpage while maintaining the improved electrical conductivity.
3Reliability
If the thickness difference between heat dissipation plate and circuit plate is increased to optimize performance, then functional performance is improved, but structural stability deteriorates
Solution Approach 1:
The patent applies asymmetry by making the brazing material layer thicknesses asymmetric. The first brazing material layer has a greater thickness than the second brazing material layer when the heat dissipation plate is thicker than the circuit plate. This asymmetric configuration compensates for the thickness difference between the plates, maintaining structural stability while allowing optimized functional performance.
Solution Approach 2:
The patent changes the parameter of brazing material layer thickness to resolve the contradiction. By adjusting the thickness of the first and second brazing material layers differently, the patent compensates for the thickness difference between the heat dissipation plate and circuit plate, thereby maintaining structural stability while allowing optimized functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses warpage in ceramic substrates even when one of the heat dissipation or circuit plates is thicker, ensuring reliable thermal conductivity and structural integrity, with the ability to be divided for specific component mounting.
Implementation Method 1
a first brazing material layer provided on a first main surface of the insulating base; a second brazing material layer provided on a second main surface of the insulating base; a circuit plate comprising a metal and being fixed through the first brazing material layer to the insulating base; and a heat dissipation plate comprising a metal and being fixed through the second brazing material layer to the insulating base
Implementation Method 2
a flat plate-shaped insulating base comprising a ceramic; a circuit plate comprising a metal and being fixed through the first brazing material layer to the insulating base on a first main surface-side; and a heat dissipation plate comprising a metal and being fixed through the second brazing material layer to the insulating base on a second main surface-side
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3~4
AI summary
A ceramic substrate is provided with a flat plate-shaped insulating base composed of a ceramic, a first brazing material layer provided on a first main surface of the insulating base, second brazing material layer provided on a second main surface of the insulating base, a circuit plate composed of a metal and fixed through the first brazing material layer to the insulating base on a first main surface-side, and a heat dissipation plate composed of a metal and fixed through the second brazing material layer to the insulating base on a second main surface-side. A thickness of one of the heat dissipation plate and the circuit plate is larger than a thickness of the other. When the thickness of the heat dissipation plate is larger than the thickness of the circuit plate, a thickness of the first brazing material layer is larger than a thickness of the second brazing material layer. When the thickness of the circuit plate is larger than the thickness of the heat dissipation plate, the thickness of the second brazing material layer is larger than the thickness of the first brazing material layer.