Ceramic Substrate Assembly With Flip-Chip Spacer and Water Cooling
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Solution Overview
Problem
Existing ceramic substrate units for electric vehicles face challenges in effectively dissipating heat generated by semiconductor chips, leading to performance degradation and potential failure due to overheating.
Innovation Solution
A ceramic substrate unit is designed with a ceramic substrate having metal layers on both surfaces, a heat dissipation spacer with an electrode for flip chip bonding of semiconductor chips, and a heat sink with protrusions for water-cooled heat dissipation. This configuration enhances heat transfer and dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat sink is used for heat dissipation, then thermal conductivity is improved, but heat dissipation efficiency is limited and cooling efficiency suddenly reduces when heat exceeds a certain limit
Solution Approach 1:
The patent introduces a water-cooling system with cooling channels formed by protrusions and recesses between heat sink fins. Liquid coolant flows through these channels to actively remove heat, preventing the sudden reduction in cooling efficiency that occurs with passive metal heat sinks when heat load exceeds certain limits. This hydraulic cooling approach maintains stable heat dissipation performance under high thermal loads.
Solution Approach 2:
The heat sink combines metal fins (for high thermal conductivity) with a ceramic substrate (for thermal stability and electrical insulation). This composite structure leverages the advantages of both materials: the metal provides efficient heat conduction from the semiconductor chip, while the ceramic substrate maintains dimensional stability under thermal stress and provides electrical isolation, preventing the performance degradation seen in pure metal heat sinks.
2Power
If a semiconductor chip operates at high voltage and high current, then power output is improved, but heat generation increases causing chip deterioration and performance reduction
Solution Approach 1:
The patent introduces a heat dissipation spacer as an intermediary component between the semiconductor chip and the heat sink. This spacer provides a dedicated thermal conduction path that efficiently transfers heat away from the chip while maintaining electrical isolation. The spacer's high thermal conductivity and strategic positioning ensure that heat generated during high-power operation is rapidly conducted to the cooling system, preventing chip deterioration and maintaining reliability.
Solution Approach 2:
The water-cooling system with channels formed by protrusions and recesses acts as a hydraulic heat removal mechanism. Coolant flows continuously through these channels, providing active heat extraction from the heat sink. This hydraulic cooling system enables the semiconductor chip to operate at high voltage and current by continuously removing generated heat, thereby maintaining chip durability and performance under high-power conditions.
3Power
If the substrate is exposed to high heat, then power conversion capability is improved, but substrate characteristics are deteriorated due to heat-induced bending
Solution Approach 1:
The substrate is constructed as a composite structure with a ceramic base and metal layers. The ceramic material provides exceptional thermal stability and resistance to heat-induced bending, while the metal layers (including the lower metal layer bonded to the heat sink) provide electrical conductivity for power conversion. This composite architecture allows the substrate to maintain its dimensional stability and structural integrity even when exposed to high heat during power conversion operations.
Solution Approach 2:
The heat dissipation spacer serves as a thermal intermediary that intercepts heat before it can cause excessive temperature rise in the substrate. By providing a dedicated high-conductivity thermal path from the chip through the spacer to the heat sink, the spacer protects the substrate from thermal stress and heat-induced bending, enabling stable power conversion capability under high-temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly improves heat dissipation performance, reduces inductance values, and enhances reliability and efficiency, particularly in high-power applications, by effectively transferring heat from semiconductor chips to the ceramic substrate and heat sink through the heat dissipation spacer.
Implementation Method 1
heat generated from a semiconductor chip is transferred to a ceramic substrate and a heat sink through the heat dissipation spacer
Implementation Method 2
heat generated from a semiconductor chip is transferred to a ceramic substrate and a heat sink through the heat dissipation spacer
Implementation Method 3
The liquid refrigerant that circulates through the refrigerant circulation part may be heat-exchanged with the plurality of protrusions
Implementation Method 4
The liquid refrigerant that circulates through the refrigerant circulation part may be heat-exchanged with the plurality of protrusions
Data Source
AI summary
The present invention relates to a ceramic substrate unit and a manufacturing method therefor. The ceramic substrate unit comprises: a ceramic substrate having metal layers on the upper and lower surfaces of the ceramic substrate; a heat dissipation spacer bonded to the upper metal layer of the ceramic substrate; and a heat sink bonded to the lower metal layer of the ceramic substrate, wherein the heat dissipation spacer is provided with an electrode in a region to which a semiconductor chip is bonded, so that the semiconductor chip may be bonded in the form of a flip chip.