Ceramic Support Terminals for Heat-Resistant Wire Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Manufacturing connections between wires and ceramic plates in substrate support assemblies pose challenges due to high temperatures, leading to manufacturing variability, frequent wire detachment, and reduced reliability, especially during substrate processing.
Innovation Solution
A method involving terminals with elongated openings through which wires are threaded, looped, and twisted to ensure mechanical stability and electrical contact, with optional reinforcement using solder or conductive epoxy, thermally decoupling the wire from the ceramic plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional high-temperature manufacturing methods are used to attach wires to ceramic plates, then electrical contact is achieved, but manufacturing variability increases and wire detachment becomes frequent
Solution Approach 1:
The patent introduces a terminal as an intermediary component between the wire and the ceramic plate. The terminal includes a body portion embedded in the ceramic plate and a distal portion extending outward for wire attachment. This intermediary structure allows wire attachment at lower temperatures while maintaining reliable electrical contact, thereby reducing manufacturing variability and preventing wire detachment.
Solution Approach 2:
The patent changes the temperature parameter for wire attachment from high temperature to lower temperature by using the terminal structure. This parameter change enables more precise and controlled manufacturing processes, reducing manufacturing variability while maintaining wire attachment reliability through the mechanical interlocking and bonding features of the terminal.
2Productivity
If high temperatures are used during substrate processing, then processing functions are achieved, but wire detachment frequency increases
Solution Approach 1:
The patent segments the electrical connection system into three distinct components: the ceramic plate, the terminal, and the wire. The terminal acts as a separate, robust attachment point that can withstand high processing temperatures without compromising wire integrity. This segmentation allows the wire to be mechanically and electrically connected to the ceramic plate through the terminal, maintaining reliability during high-temperature substrate processing.
Solution Approach 2:
The terminal serves as a heat-resistant intermediary that protects the wire from direct exposure to high processing temperatures. The terminal's structure and material properties enable it to withstand thermal stress while maintaining the electrical connection, thereby preventing wire detachment during high-temperature substrate processing operations.
3Reliability
If conventional wire attachment methods are used, then electrical contact is established, but manufacturing complexity and yield issues increase
Solution Approach 1:
The terminal is pre-formed and embedded in the ceramic plate before wire attachment. This preliminary action creates a prepared, stable base for wire attachment that simplifies the subsequent wiring process. The terminal's pre-configured structure with bonding surfaces and mechanical features enables easier and more reliable wire attachment, improving overall manufacturability while maintaining electrical contact reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows reliable wire attachment at lower temperatures, ensuring electrical contact, mechanical strength, and improved manufacturability, reducing manufacturing yield issues and enhancing part reliability.
Implementation Method 1
The electrically bonding material includes a solder material or an epoxy
Implementation Method 2
The electrically bonding material includes a solder material or an epoxy
Implementation Method 3
the openings of the terminals thermally decouple the respective wires from the ceramic plate during processing of a substrate
Data Source
AI summary
A substrate support assembly includes a baseplate, a ceramic plate arranged on the baseplate, and a plurality of wires. The ceramic plate includes a plurality of slots arranged on a side facing the baseplate and a plurality of electrically conducting terminals disposed in the plurality of slots, respectively. Each of the terminals includes a base portion connected to the ceramic plate, a second portion extending from the base portion towards the baseplate, and an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion. Each of the wires passes through the opening of the respective terminal and is braided around the distal end of the second portion of the respective terminal.