Ceramic Susceptor Brazing Structure for Leak-Tight MMC Bonding
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Solution Overview
Problem
Conventional ceramic susceptors with metal matrix composite (MMC) base bodies experience poor bonding between upper and lower plates due to the use of general aluminum brazing-bonding methods, leading to issues like gas leakage and poor vacuum conditions during semiconductor processing.
Innovation Solution
A method of manufacturing a ceramic susceptor base body involves applying multi-layer surface treatment, including active metal and aluminum layers, between the base body plates and the brazing filler to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If general aluminum brazing-bonding method is used for MMC base body, then manufacturing process is simple, but bonding strength is poor causing gas leakage and coolant leakage
Solution Approach 1:
The invention changes the chemical composition parameters of the brazing filler metal by specifying precise ranges for Si (2-10 wt%), Mn (0.1-2 wt%), and other elements. This parameter optimization enables the brazing filler to achieve strong bonding with MMC plates while maintaining process simplicity, resolving the contradiction between ease of manufacture and bonding reliability
Solution Approach 2:
The invention uses a composite brazing filler metal composition that combines multiple elements (Al-Si-Mn-Ni-Fe-Cr system) to achieve both strong bonding strength and ease of manufacture. The composite composition allows the filler to bond effectively with MMC plates while maintaining a relatively low brazing temperature and simple process
2Stability of the object's composition
If MMC base body is used to prevent low-temperature deformation, then thermal stability is improved, but bonding between plates deteriorates due to material incompatibility with aluminum brazing filler
Solution Approach 1:
The invention optimizes the chemical composition parameters of the brazing filler metal, specifically setting Si content at 2-10 wt% and Mn content at 0.1-2 wt%, to achieve compatible bonding with MMC plates. This parameter adjustment allows the brazing filler to overcome the material incompatibility issue while preserving the thermal stability benefits of MMC
Solution Approach 2:
The brazing filler metal acts as an intermediary material that bridges the MMC plates. The specifically formulated Al-Si-Mn-Ni-Fe-Cr composition enables effective bonding between MMC plates, resolving the material incompatibility issue while maintaining the thermal stability advantages of the MMC base body
3Ease of manufacture
If poor bonding occurs between plates, then manufacturing process remains simple, but process reliability deteriorates due to gas leakage and vacuum problems
Solution Approach 1:
The invention optimizes the chemical composition parameters of the brazing filler metal to achieve strong, leak-free bonding. This ensures high process yield and reliability while maintaining relatively simple manufacturing procedures, resolving the contradiction between ease of manufacture and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved bonding strength reduces gas leakage and coolant leakage, maintaining a stable vacuum and increasing yield in semiconductor processing, with the He gas leak rate decreased from 1.0E-03 to 2.0E-08 (mbar*l/s).
Implementation Method 1
brazing-bonding the lower plate and the upper plate such that the first aluminum layer and the second aluminum layer are bonded to each other via the brazing filler layer
Data Source
AI summary
The present disclosure relates to a ceramic susceptor. In a method of manufacturing a base body of a ceramic susceptor of the present disclosure, which includes a lower plate and an upper plate, which are each made of a metal-ceramic composite and bonded to each other, the method includes: sequentially laminating a first active metal layer, a first aluminum layer, and a brazing filler layer on a bonding surface of the upper plate; sequentially laminating a second active metal layer and a second aluminum layer on a bonding surface of the lower plate; and brazing-bonding the lower plate and the upper plate with the brazing filler layer.