Ceramic Susceptor Layout for Thermocouple Paths Without Electrode Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The incorporation of internal electrodes such as ESC or RF electrodes into ceramic heaters with thermocouple insertion paths can negatively impact attraction performance or plasma characteristics, limiting the ceramic heater's maximum performance.
Innovation Solution
The thermocouple insertion groove is arranged at a depth between the internal electrode and the first heater circuit in the thickness direction of the ceramic plate, minimizing interference with the internal electrodes' performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a thermocouple insertion path is provided in the ceramic plate, then temperature measurement capability is improved, but the attraction performance or plasma characteristics of internal electrodes deteriorate
Solution Approach 1:
The patent transitions from a conventional planar arrangement where the thermocouple insertion path lies in the same plane as the internal electrode, to a three-dimensional arrangement where the thermocouple insertion path is positioned at a depth between the internal electrode and the first heater circuit. This spatial separation in the thickness direction eliminates interference between the thermocouple path and internal electrode, allowing both temperature measurement and plasma generation functions to operate optimally without mutual degradation
2Adaptability or versatility
If internal electrodes such as ESC or RF electrodes are incorporated into the ceramic heater, then functional versatility is improved, but the performance of the internal electrodes deteriorates due to interference from the thermocouple insertion path
Solution Approach 1:
The patent resolves the conflict between incorporating multiple functions (heater circuit, internal electrodes, thermocouple insertion path) by utilizing the thickness direction of the ceramic plate as an additional dimension. By positioning the thermocouple insertion path at a depth between the internal electrode and the first heater circuit, the patent enables all components to coexist without spatial interference, thereby achieving high functional versatility while maintaining optimal performance of each component
Solution Approach 2:
The patent employs a nested arrangement where the thermocouple insertion path is positioned within the thickness direction between the internal electrode and the first heater circuit. This nested configuration allows multiple functional elements to be integrated within the ceramic plate structure without mutual interference, enabling the ceramic heater to incorporate diverse functions (heating, temperature measurement, plasma generation) while maintaining the performance integrity of each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the undesirable influence on attraction performance or plasma characteristics, allowing the ceramic heater to maximize its desired performance while incorporating both heater circuits and internal electrodes.
Implementation Method 1
a first heater circuit embedded in the lower ceramic plate parallel to the first surface; and a second heater circuit embedded in the upper ceramic plate parallel to the first surface
Implementation Method 2
a thermocouple insertion groove provided in the bonding surface side of the upper ceramic plate or the lower ceramic plate, the thermocouple insertion groove forming a thermocouple insertion path together with the bonding surface
Data Source
AI summary
There is provided a ceramic susceptor including: a disk-shaped ceramic plate bonded body including an upper ceramic plate and a lower ceramic plate bonded to each other at a bonding surface, the disk-shaped ceramic plate bonded body having a first surface opposite the bonding surface of the upper ceramic plate and a second surface opposite the bonding surface of the lower ceramic plate; at least one internal electrode selected from the group consisting of an RF electrode and an ESC electrode, the internal electrode being embedded in the upper ceramic plate parallel to the first surface; a first heater circuit embedded in the lower ceramic plate parallel to the first surface; and a thermocouple insertion groove provided in the bonding surface side of the upper ceramic plate or the lower ceramic plate, the thermocouple insertion groove forming a thermocouple insertion path together with the bonding surface.