Ceramic Susceptor Heating Layout for Uniform Wafer Temperature
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional ceramic susceptors exhibit non-uniform temperature distribution across their surface due to non-heating areas caused by symmetrical folding parts of the heating element pattern, leading to cool zones and reduced process yield in semiconductor manufacturing.
Innovation Solution
A susceptor design with a main heating element in a concentric pattern and additional compensation heating elements stacked on different planes, configured to eliminate non-heating areas by intersecting connection parts at varying diameters, ensuring uniform temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heating element pattern with symmetrical folding parts is used, then the heating element can be connected between terminals, but non-heating areas are caused leading to non-uniform temperature distribution
Solution Approach 1:
The heating element pattern is designed with asymmetrical folding parts instead of symmetrical ones. The first folding part has a different configuration from the second folding part, which eliminates the formation of non-heating areas and cool zones, thereby achieving uniform temperature distribution across the susceptor surface.
Solution Approach 2:
The invention introduces a multi-layer structure where heating elements are arranged in different planes (first layer and second layer). This dimensional change allows the heating elements to overlap and compensate for each other, eliminating non-heating areas and achieving uniform temperature distribution that cannot be accomplished with a single-plane pattern.
2Temperature
If straight connecting lines are used to connect terminals, then the heating element pattern is simple, but heat generation is insufficient in the connection area
Solution Approach 1:
The connection parts of the heating element pattern are designed with curved configurations instead of straight lines. The first connection part and second connection part include curves that increase the path length and resistance, thereby enhancing heat generation in the connection areas while maintaining pattern manageability.
3Temperature
If multiple heating zones are created with separate heating element patterns, then different temperature areas are achieved, but non-heating areas exist between the patterns
Solution Approach 1:
The heating elements from the first layer and second layer are merged through overlapping arrangement. The first heating element and second heating element are positioned such that they overlap in the vertical direction, combining their heating zones to eliminate non-heating areas and maximize the effective heated surface area.
Solution Approach 2:
By transitioning from a single-plane to a multi-layer configuration, the heating elements occupy different vertical positions (first layer and second layer). This dimensional change allows the heating zones to overlap and complement each other, eliminating gaps and non-heating areas between separate heating zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The susceptor achieves improved temperature uniformity across its entire surface, enhancing process yield and durability by minimizing temperature deviations and eliminating cool zones.
Implementation Method 1
the heating element receives power and generates heat to heat semiconductor wafer substrates or the like
Data Source
AI summary
Provided is a ceramic susceptor including an insulation plate on which a first heating element of a first layer and a second heating element of a second layer are arranged and stacked, wherein the first heating element is located between and connected to a pair of first terminals, and the second heating element is located between and connected to a pair of second terminals, the first heating element includes multiple concentric arc-shaped first resistance parts and first connection parts configured to connect the resistance parts at different diameter positions, and at least one of the first connection parts crosses a virtual line connecting the centers between both end portions of each of the first resistance parts.