Ceramic Electronic Component Terminal Electrode Thickness Ratio
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Solution Overview
Problem
Ceramic electronic components face challenges in achieving satisfactory capacitance, weather resistance, and mechanical strength due to the limitations of traditional external terminal electrode structures, which often result in increased thickness and susceptibility to stress-related defects.
Innovation Solution
A ceramic electronic component design featuring a first conductive layer formed by plating directly on the ceramic element's surface, coupled with a second conductive layer made of conductive resin, where the thickness ratio of the second conductive layer to the first layer (T2/T1) ranges from about 3.4 to 11.3, ensuring a robust and stress-absorbing external terminal electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external terminal electrode includes two layers (first electrode layer formed by plating and second electrode layer made of conductive resin), then stress caused by warping of the substrate can be relaxed and defects are reduced, but the thickness of the external terminal electrode increases and sufficient capacitance characteristic and mechanical strength characteristic may be unobtainable
Solution Approach 1:
The invention optimizes the thickness parameters of the conductive layers, specifically setting the thickness of the first conductive layer to 3.6-10.2 μm and the second conductive layer to 34.3-40.8 μm, achieving a thickness ratio T2/T1 of 3.4-11.3. This parameter optimization allows the external terminal electrode to maintain adequate stress resistance while controlling the overall thickness to preserve effective volume ratio and electrical characteristics.
Solution Approach 2:
The external terminal electrode employs a composite structure combining two different conductive materials: a first conductive layer (metallic plating) and a second conductive layer (conductive resin). This composite material approach leverages the strengths of each material - the metallic layer provides electrical conductivity and adhesion to the internal electrode, while the conductive resin layer provides stress absorption and mechanical strength - achieving both reliability and controlled thickness.
2Reliability
If the external terminal electrode includes two layers, then defects such as degradation in electrical characteristics and occurrences of cracks are reduced, but satisfactory capacitance characteristic, moisture resistance, and mechanical strength characteristic may be unobtainable
Solution Approach 1:
The invention establishes specific parameter ranges for the conductive layers (thickness of first layer: 3.6-10.2 μm, thickness of second layer: 34.3-40.8 μm, ratio T2/T1: 3.4-11.3) that simultaneously achieve defect resistance, satisfactory capacitance characteristic, moisture resistance, and mechanical strength characteristic. This parameter optimization resolves the contradiction by finding the optimal manufacturing window.
Solution Approach 2:
The dual-layer conductive structure combines metallic plating and conductive resin to achieve both defect resistance and satisfactory manufacturing characteristics. The composite material structure provides crack resistance and electrical stability while maintaining manufacturability through the optimized thickness ratio and material properties.
3Strength
If the thickness of the external terminal electrode is increased to improve mechanical strength, then the effective volume ratio is reduced
Solution Approach 1:
The invention optimizes the thickness parameters of the conductive layers to achieve the minimum necessary thickness for adequate mechanical strength (first layer: 3.6-10.2 μm, second layer: 34.3-40.8 μm). By precisely controlling these parameters and their ratio (T2/T1: 3.4-11.3), the design achieves sufficient mechanical strength while minimizing the thickness increase, thereby preserving the effective volume ratio of the ceramic electronic component.
Solution Approach 2:
The composite structure of two conductive layers provides enhanced mechanical strength per unit thickness compared to a single-layer structure. The conductive resin layer (thicker) provides structural support and stress distribution, while the metallic plating layer (thinner) provides electrical connectivity, achieving high strength-to-thickness ratio and preserving effective volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains a reduced external terminal electrode thickness while enhancing mechanical strength and weather resistance, ensuring reliable electrical connections and improved capacitance characteristics.
Implementation Method 1
The first conductive layer is formed by plating directly on the side surfaces so as to be electrically coupled to the exposed section of the inner electrode
Data Source
AI summary
A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.