Ceramic Heater Terminal Joining Layer Design

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Solution Overview

Problem

Existing ceramic structures with metal terminals face issues with joining strength and reliability due to thermal expansion mismatches, leading to potential peeling of the joining layer, which can result in electrical connection failures and positional deviations.

Innovation Solution

A ceramic structure with a metal terminal and a joining layer containing metal, where the joining layer extends from the terminal to a second surface within the ceramic base body, intersecting with the first surface, enhancing the joining strength and reliability by managing thermal expansion differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a joining layer is used to bond the ceramic base body and metal terminal, then the electrical connection is established, but the joining layer peels due to thermal expansion mismatch

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidjoining layer strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The joining layer is extended from a simple surface-level bond to a three-dimensional structure that penetrates into the ceramic base body along the thickness direction. This dimensional extension creates anchor points within the ceramic, transforming a two-dimensional surface bond into a multi-point three-dimensional connection that resists peeling forces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The joining layer is divided into multiple functional regions: a first region at the surface level for electrical connection, and a second region extending into the ceramic base body for mechanical anchoring. This segmentation allows each region to perform its specialized function - the surface region provides electrical conductivity while the embedded region provides structural stability.

Inventive Principle:
Principle #1Segmentation

2Strength

If the joining layer is extended deeper into the ceramic base body, then the joining strength improves, but the manufacturing complexity increases

Engineering Contradiction:
Improvejoining strengthVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The joining layer formation process is merged with the existing ceramic manufacturing process. The joining layer is formed as an integral part of the ceramic structure during the same manufacturing cycle, eliminating the need for separate embedding steps and reducing overall manufacturing complexity despite the enhanced three-dimensional structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The joining layer is prepared in advance as a precursor structure before the ceramic manufacturing process completes. By pre-forming the joining layer with its extended structure, the subsequent ceramic processing steps automatically complete the embedding without requiring additional complex operations.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If the joining layer is positioned only at the surface level, then the manufacturing process is simple, but the electrical connection reliability deteriorates under thermal stress

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectrical connection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The joining layer transitions from a two-dimensional surface layer to a three-dimensional structure with depth penetration. This dimensional change maintains manufacturing simplicity by using the same surface deposition techniques while adding the depth dimension that provides thermal stress resistance through mechanical anchoring in the ceramic substrate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Stability of the object's composition

If the ceramic base body undergoes thermal expansion, then the structural integrity is maintained, but the joining layer peels due to differential expansion with the metal terminal

Engineering Contradiction:
Improveceramic structural integrityVSAvoidjoining layer adhesion
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The joining layer is designed with extended depth penetration into the ceramic base body before thermal cycling occurs. This pre-established deep anchoring structure acts as a cushion against thermal expansion stresses, absorbing the differential expansion forces between the metal terminal and ceramic base body and preventing peeling during subsequent thermal cycles.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces the probability of peeling and improves the reliability of the electrical connection between the terminal and the ceramic base body, maintaining structural integrity and functionality under temperature changes.

Implementation Method 1

Existing ceramic structures with metal terminals face issues with joining strength and reliability due to thermal expansion mismatches

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11945755B2Ceramic structure and structure with terminal
Publication Date: 2024.04.02 KYOCERA CORP
  • US11945755B2 patent drawing
  • US11945755B2 patent drawing
  • US11945755B2 patent drawing

AI summary

A heater includes a base body, terminal and joining layer. The base body is made of ceramic. The joining layer contains metal as a principal ingredient and is located between the base body and the terminal. The base body includes a first surface and second surface. The first surface faces an outer side of the base body and includes at least one of a region which is superimposed on the terminal and a region which is located on a periphery of the terminal. The second surface intersects with the first surface and is located on the side closer to an internal portion of the base body on the side away from the first surface. The joining layer extends from the terminal and first surface up to the second surface.