Ceramic Terminal Package Layout Without Exterior Molding
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Solution Overview
Problem
Conventional electronic devices for surface mounting require a complex assembly process due to the need for a molding step with an exterior material and are inflexible to changes in dielectric disk size.
Innovation Solution
An electronic device design that accommodates a ceramic element in a recess of a case, eliminating the need for a molding step with an exterior material and allowing flexible response to size changes, featuring metal terminals that pass through spaces between a case and a case cover for sealing and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding step with an exterior material is used to fix the dielectric disk and metal terminal in a cavity, then the electronic device is protected and sealed, but the assembly process complexity increases and productivity decreases
Solution Approach 1:
The metal terminals are preliminarily fixed to the dielectric disk before assembling the case, and the case is designed with a recess that pre-accommodates the dielectric disk. This preliminary arrangement eliminates the need for post-assembly molding steps, reducing process complexity while maintaining protection and sealing functions.
2Reliability
If a molding step with an exterior material is used to fix the dielectric disk and metal terminal in a cavity, then the electronic device is protected and sealed, but the number of manufacturing steps increases
Solution Approach 1:
The metal terminals are preliminarily fixed to the dielectric disk before assembling the case, and the case is designed with a recess that pre-accommodates the dielectric disk. This preliminary arrangement eliminates the need for post-assembly molding steps, reducing process complexity while maintaining protection and sealing functions.
3Adaptability or versatility
If the size of the dielectric disk is changed, then the electronic device can be adapted to different applications, but the molding die must be changed making it difficult to respond flexibly
Solution Approach 1:
The case is designed with a recess that can accommodate dielectric disks of different sizes, and the metal terminals are preliminarily fixed to the dielectric disk before assembly. This universal design allows the same case structure to adapt to various dielectric disk sizes without requiring changes to the molding die, enabling flexible response to size changes while maintaining ease of manufacture.
Data Source
AI summary
An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.


