Ceramic Component Metal Terminal Plating Removal for Vibration
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Solution Overview
Problem
Stacked ceramic capacitors generate acoustic noise due to mechanical strain-induced vibration, which is not adequately mitigated by existing solutions, as the gap between the capacitor and the mounting substrate is not sufficiently secured, hindering the elastic deformation of metal terminals and leading to insufficient vibration suppression.
Innovation Solution
A ceramic electronic component design featuring metal terminals with a plating-removal portion on their peripheral surfaces, reducing solder wetting and ensuring a gap between the component and the substrate, allowing for effective elastic deformation and reduced vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plated film is formed on the surface of metal terminals to improve solder wettability, then solder wettability is improved, but the gap between the capacitor and mounting substrate is not sufficiently secured, causing solder to fill the gap and hinder elastic deformation of metal terminals
Solution Approach 1:
The patent applies different surface treatments to different regions of the metal terminal. The distal end surface (facing the capacitor) is left with the plated film to ensure good solder wettability and bonding, while the side surface (where the gap should be maintained) has the plated film removed or is left bare. This local differentiation allows the terminal to maintain both good solder joint quality and sufficient elastic deformation capability for vibration suppression.
2Manufacturing precision
If the gap between the stacked ceramic capacitor and mounting substrate is reduced to improve mounting precision, then mounting precision is improved, but the elastic deformation of metal terminals is hindered, reducing vibration suppression effectiveness
Solution Approach 1:
The patent optimizes the gap dimension to a specific range (0.05mm to 0.2mm) that balances two competing requirements: it is small enough to achieve good mounting precision and positioning, but large enough to allow sufficient elastic deformation of the metal terminals. This parameter optimization enables the system to simultaneously achieve precise mounting and effective vibration suppression.
3Strength
If metal terminals are made more rigid to improve structural strength, then structural strength is improved, but elastic deformation is reduced, decreasing vibration suppression capability
Solution Approach 1:
The patent creates a local quality difference in the metal terminal structure by applying different surface treatments to different regions. The plated film at the distal end provides strong bonding strength for structural integrity, while the bare metal surface at the side allows for greater elastic deformation. This local differentiation enables the terminal to simultaneously achieve both structural strength and vibration suppression capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces or prevents the generation of vibration sound on the mounting substrate by securing the gap and maintaining the elastic deformation of metal terminals, effectively addressing the acoustic noise issue.
Implementation Method 1
solder wettability of the mounting solder with respect to the metal terminal 8 is improved
Implementation Method 2
a stress, which is generated in synchronization with a frequency of the AC voltage, is mitigated with elastic deformation of the pair of metal terminals 8
Implementation Method 3
the mounting solder tends to wet a portion between the stacked ceramic capacitor 2 and the metal terminals 8 along the plated film on the surface of the metal terminals 8
Data Source
AI summary
A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed.