Multilayer Ceramic Component Terminals for Warped Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face stress and potential damage due to thermal expansion coefficient differences between the capacitor and mounting substrate, leading to issues like cracking and poor solder joint reliability in high-temperature environments, especially when the substrate warps or has uneven surfaces.
Innovation Solution
A multilayer ceramic electronic component design featuring metal terminals with extending portions and protrusions that create gaps between the component and substrate, allowing for reliable welding even on warped or uneven surfaces, using laser welding through recesses on the substrate side, and surface treatments to enhance energy absorption and contact efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to mount the metal terminal to the mounting substrate, then the electrical connection is established, but the solder joint reliability deteriorates in high-temperature environments due to solder melting or weakening
Solution Approach 1:
The patent replaces the soldering process with laser welding to join the metal terminal to the mounting substrate. This substitution eliminates the reliance on solder joints that fail at high temperatures, providing a more reliable mechanical and electrical connection that can withstand elevated operating conditions without melting or weakening.
Solution Approach 2:
The patent changes the joining method from low-temperature soldering to high-temperature laser welding, fundamentally altering the thermal parameters of the mounting process. This parameter change enables the creation of a joint that can withstand high-temperature environments, directly addressing the reliability issue in automotive and industrial applications.
2Productivity
If laser welding is used to mount the metal terminal, then the welding speed is increased, but the welding reliability deteriorates when the mounting substrate is warped or has uneven surfaces
Solution Approach 1:
The patent incorporates a positioning protrusion on the metal terminal that engages with a corresponding positioning recess on the mounting substrate before welding. This preliminary positioning action ensures proper alignment and stable contact between the welding surfaces, preventing welding failures due to substrate warpage or unevenness while maintaining the high speed advantage of laser welding.
Solution Approach 2:
The positioning protrusion and recess act as an intermediary mechanical feature that mediates between the metal terminal and the mounting substrate. This intermediary structure compensates for surface irregularities and warpage, ensuring reliable laser welding by maintaining proper contact and alignment during the high-speed welding process.
3Reliability
If the metal terminal is kept in surface contact with the mounting substrate for welding, then the welding contact is reliable, but the time required to make the connection increases
Solution Approach 1:
The positioning protrusion and recess are pre-formed features that automatically align and establish contact between the metal terminal and mounting substrate during the mounting process. This preliminary action eliminates the need for time-consuming manual positioning or adjustment, enabling rapid and reliable welding contact.
Solution Approach 2:
The positioning protrusion on the metal terminal self-aligns with the positioning recess on the mounting substrate, enabling automatic positioning and contact establishment. This self-service mechanism eliminates the need for external positioning devices or manual intervention, reducing connection time while ensuring reliable welding contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables reliable mounting and welding of multilayer ceramic capacitors on warped or uneven substrates, reducing stress and improving durability and performance by ensuring consistent contact and efficient energy absorption during thermal expansion.
Implementation Method 1
the protrusions are in contact with a mounting surface of a mounting substrate, and the protrusions are joined to the mounting substrate of the mounting board by welding
Implementation Method 2
laser welding through recesses on the substrate side
Data Source
AI summary
A multilayer ceramic electronic component includes a first metal terminal including a first terminal joining portion connected to a first end surface, a first extending portion connected to the first terminal joining portion and extending toward a mounting surface, and a first mounting portion connected to the first extending portion and extending in a length direction connecting the first end surface and a second end surface; a second metal terminal including a second terminal joining portion connected to the second end surface, a second extending portion extending from the second terminal joining portion toward the mounting surface, and a second mounting portion connected to the second extending portion and extending in a length direction connecting the first end surface and the second end surface. The first and second mounting portions include protrusions protruding toward the mounting surface.