Ceramic Component Terminals With Recess Cavities for Reflow Peeling

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Solution Overview

Problem

Multilayer ceramic electronic components face the risk of metal terminal peeling during reflow due to volume expansion of bonding materials, leading to increased internal pressure without a release mechanism.

Innovation Solution

Incorporating recess portions in the metal terminals with plating films, allowing the bonding material to flow into these cavities during reflow, thereby reducing internal pressure and preventing peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding material is used to connect metal terminals to external electrodes, then reliable electrical connection is achieved, but volume expansion during reflow causes internal pressure increase leading to peeling

Engineering Contradiction:

Improvebonding reliabilityVSAvoidpeeling resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The metal terminal is designed with a recess portion that creates a cavity structure. This cavity acts as a porous space that can absorb the volume expansion of the bonding material during reflow, preventing pressure buildup that would cause peeling while maintaining bonding reliability.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The recess portion is pre-formed in the metal terminal before bonding. This预先 created cavity serves as a cushioning space that anticipates and accommodates the volume expansion of the bonding material during subsequent reflow processing, preventing harmful pressure effects.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If bonding material volume is allowed to expand during reflow, then bonding reliability is maintained, but internal pressure increases causing peeling of exterior material

Engineering Contradiction:

Improvebonding reliabilityVSAvoidinternal pressure

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The recess portion creates a cavity structure within the metal terminal that provides space for the bonding material to expand into during reflow. This prevents pressure buildup within the exterior material while maintaining bonding integrity.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The harmful effect of volume expansion is extracted and redirected into the recess portion cavity. Instead of allowing expansion to occur within the confined exterior material causing pressure buildup, the expansion space is separated into the dedicated recess portion.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If metal terminal structure is modified to include recess portions, then peeling is prevented, but manufacturing complexity increases

Engineering Contradiction:

Improvepeeling resistanceVSAvoidterminal structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The metal terminal surface is segmented by creating a recess portion, dividing the surface into different levels (raised portions and recessed portions). This segmentation provides the necessary cavity space for bonding material expansion while maintaining overall structural simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The recess portion is created only in specific local areas of the metal terminal where bonding material expansion occurs, rather than modifying the entire terminal structure. This localized modification maintains manufacturing simplicity while achieving the pressure relief function.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the risk of peeling and stress on the exterior material, ensuring reliable bonding and mounting of the multilayer ceramic components.

Implementation Method 1

the first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed... the first recess portion and the second recess portion each include cavities... the bonding material may be melted during reflow at the time of board mounting, such that the volume of the bonding material may expand

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS11887787B2Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component

Publication Date: 2024.01.30 MURATA MFG CO LTD

AI summary

A multilayer ceramic electronic component includes a first metal terminal including a first plating film on a surface of a first terminal main body, and a second metal terminal including a second plating film on a surface of the second terminal main body. The first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed. The second metal terminal includes a surface connected to the second external electrode on which a second recess portion is provided such that the second terminal main body is exposed. The first and second recess portions each include cavities. An exterior material covers the multilayer ceramic electronic component main body, the bonding material, a portion of the first metal terminal, and a portion of the second metal terminal.