Electronic device having ceramic element and metal terminals
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Solution Overview
Problem
Conventional electronic devices, such as capacitors, experience connection failures between the dielectric disk and metal terminals when high voltages are applied, due to insufficient pressure resistance.
Innovation Solution
The electronic device incorporates solder stoppers with undulations on the electrode connection portions to control the solder adhesion region, featuring solder storage and outflow prevention portions to manage solder distribution, and is housed in a case with a housing recess for improved pressure resistance and ease of mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the amount of solder for connecting the electrode connection portion and the electrode portion is increased, then the connection strength is improved, but the pressure resistance decreases
Solution Approach 1:
The solder stopper creates a localized adhesion region with controlled dimensions on the electrode connection portion. By undulating the facing surface to form a flattened portion with specific area, the solder is confined to a defined local region, preventing excessive solder from spreading and causing pressure resistance issues while still providing adequate connection strength in the adhesion region.
2Reliability
If the adhesion region of solder is increased to improve connection reliability, then the connection reliability is improved, but the pressure resistance decreases
Solution Approach 1:
The invention changes the geometric parameters of the electrode connection portion by undulating the facing surface to create a flattened portion with controlled area. This parameter change defines a specific adhesion region size that optimizes the balance between connection reliability and pressure resistance, preventing solder from adhering over the entire surface while ensuring reliable connection in the designated region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration enhances the pressure resistance of the electronic device, allowing it to withstand medium to high voltages without cracks, while ensuring stable connections and efficient manufacturing.
Implementation Method 1
control a range of an adhesion region of solder to the first electrode portion
Implementation Method 2
storing the solder in the recessed portion with the closed edge
Data Source
AI summary
An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.