Ceramic Electronic Component Metal Terminal Solder Wettability Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ceramic electronic components with metal terminals experience squealing noise due to electric strain, primarily caused by excessive solder adherence during mounting, which transfers vibrations to the mounting board.
Innovation Solution
The ceramic electronic component features metal terminals with a solder adhering prevention area on the mounting portion upper face and flat plate portion, having lower wettability than the mounting portion bottom face, preventing excessive solder adherence and vibration transfer, thereby reducing squealing noise. The terminals are designed with a flat plate portion and a mounting portion forming specific angles, and a coating layer is used to differentiate solder wettability, enhancing joining strength while preventing solder adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to attach the ceramic electronic component to the mounting board, then secure fixing and electrical conductivity are achieved, but excessive solder adheres to the mounting portion and causes squealing noise
Solution Approach 1:
The patent applies local quality by creating distinct regions on the mounting portion with different solder wettability characteristics. The mounting portion is divided into a solder adhering area (with higher wettability) and a solder adhering prevention area (with lower wettability). This localized differentiation allows the solder to securely attach where needed while preventing excessive adherence that causes vibration and noise, thus resolving the contradiction between secure fixing and noise prevention.
2Reliability
If solder is used to attach the ceramic electronic component to the mounting board, then electrical conductivity is achieved, but excessive solder adheres to parts other than the mounting portion
Solution Approach 1:
The patent implements local quality by designing the mounting portion with spatially varying surface properties. The solder adhering area provides high wettability to ensure good electrical conductivity and mechanical bonding, while the solder adhering prevention area provides low wettability to prevent solder from spreading to adjacent regions. This localized property differentiation achieves precise solder placement control without compromising electrical conductivity.
3Strength
If the mounting portion has high solder wettability, then joining strength is improved, but solder excessively adheres to the mounting portion upper face
Solution Approach 1:
The patent applies local quality by creating a solder adhering prevention area with lower wettability on the mounting portion upper face. This localized low-wettability region restricts solder spread while the solder adhering area maintains high wettability for strong joining. As a result, the joining strength is preserved through adequate solder in the adhering area, while excessive solder adherence is prevented by the low-wettability prevention area, thus controlling the total solder quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses squealing noise by preventing excessive solder adherence and vibration transfer to the mounting board, ensuring secure mounting and improved durability of the ceramic electronic component.
Implementation Method 1
a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed
Data Source
AI summary
A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.