Ceramic Electronic Device Terminal Vibration Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional ceramic electronic devices with metal terminals have a large projected area and are prone to vibration transmission from chip components to the mount board, leading to increased mount area and potential acoustic noise.
Innovation Solution
A ceramic electronic device design featuring terminal electrodes on chip end surfaces, metal terminal portions with a vertical mount portion and elastic connection to the case, which sandwiches the chip component, eliminating the need for conductive connection materials like solder and reducing vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional metal terminal with bent outward mount portion is used, then electrical connection is achieved, but the projected area becomes large and vibration transmits easily to the mount board
Solution Approach 1:
The mount portion is repositioned from the lateral direction (X-Y plane) to the vertical direction (Z-axis), extending downward from the terminal connection portion. This dimensional change reduces the projected area in the mounting plane while maintaining electrical connection functionality through the vertical extension that can be soldered to the mount board.
Solution Approach 2:
The case serves as an intermediary vibration-absorbing structure between the chip component and the mount board. The case material (mold resin or rubber) provides vibration absorption properties that prevent vibrations from the chip component from transmitting to the mount board through the metal terminal, while still allowing electrical connection.
2Reliability
If conductive connection material like solder is used to join chip component and metal terminal, then electrical connection is secured, but joint release may occur due to heat during mounting and environmental load materials are used
Solution Approach 1:
The metal terminal portion performs dual functions: it provides both mechanical support (holding the chip component through elastic force) and electrical connection. This self-sufficient design eliminates the need for separate solder joints, allowing the terminal to maintain electrical connection through its own elastic deformation capability without relying on heat-affected solder joints.
Solution Approach 2:
The metal terminal portion utilizes elastic deformation as its connection mechanism instead of permanent solder joints. The elastic force parameter allows the terminal to maintain electrical connection through reversible deformation, avoiding the thermal processes and material limitations of soldering while providing heat-resistant and environmentally friendly connection.
3Ease of manufacture
If metal terminal portions are freely positioned, then assembly is simple, but vibration easily transmits from chip component to mount board causing acoustic noise
Solution Approach 1:
The case acts as an intermediary vibration-absorbing structure between the chip component and the mount board. The case material (mold resin or rubber) provides vibration absorption properties that prevent vibrations from the chip component from transmitting to the mount board through the metal terminal, thereby reducing acoustic noise while maintaining assembly simplicity.
Solution Approach 2:
The case functions as a flexible vibration-absorbing shell that surrounds and protects the chip component and metal terminal portions. This flexible structure absorbs vibrations and prevents their transmission to the mount board, reducing acoustic noise while allowing straightforward assembly of the internal components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a smaller mount area, maintains electrical connection without solder, prevents joint release due to heat, reduces material usage, and absorbs vibrations to prevent acoustic noise.
Implementation Method 1
a contact state between the terminal connection portion and the chip end surface can be thereby maintained by elastic forces of the case and the metal terminal portions
Implementation Method 2
A vibration absorption effect of the case can reduce a vibration transmitted to a mount board and prevent an acoustic noise
Data Source
AI summary
A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.